Howard Ge

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Alhambra, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for determining leak rate through a bond line of a MEMS device
- Patent number 8,579,502
- Issue date Nov 12, 2013
- Northrop Grumman Corporation
- Henry C. Abbink
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for optimizing direct wafer bond line width for reduction of...
- Patent number 8,007,166
- Issue date Aug 30, 2011
- Northrop Grumman Systems Corporation
- Henry C. Abbink
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR DETERMINING LEAK RATE THROUGH A BOND LINE OF A MEMS DEVICE
- Publication number 20110271744
- Publication date Nov 10, 2011
- NORTHROP GRUMMAN SYSTEMS CORPORATION
- Henry C. Abbink
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Optimizing Direct Wafer Bond Line Width for Reduction of...
- Publication number 20080184778
- Publication date Aug 7, 2008
- Northrop Grumman Corporation
- Henry C. Abbink
- B81 - MICRO-STRUCTURAL TECHNOLOGY