Howard Hao Chen

Person

Yorktown Hts, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sea-of-fins structure on a semiconductor substrate and method of fa...
- Patent number 8,598,641
- Issue date Dec 3, 2013
- International Business Machines Corporation
- Howard H. Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Narrow-band wide-range frequency modulation continuous wave (FMCW)...
- Patent number 8,416,121
- Issue date Apr 9, 2013
- International Business Machines Corporation
- Howard H. Chen
- G01 - MEASURING TESTING
Information Patent Grant
Leakage sensor and switch device for deep-trench capacitor array
- Patent number 8,351,166
- Issue date Jan 8, 2013
- International Business Machines Corporation
- Howard H. Chen
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for nonvolatile multi-programmable electronic fuse system
- Patent number 8,189,419
- Issue date May 29, 2012
- International Business Machines Corporation
- Howard H. Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Laser annealing for 3-D chip integration
- Patent number 8,138,085
- Issue date Mar 20, 2012
- International Business Machines Corporation
- Howard H. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated thermoelectric cooling devices and methods for fabricati...
- Patent number 8,129,609
- Issue date Mar 6, 2012
- International Business Machines Corporation
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip design and fabrication method optimized for profit
- Patent number 8,086,988
- Issue date Dec 27, 2011
- International Business Machines Corporation
- Nathan Buck
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sea-of-fins structure on a semiconductor substrate and method of fa...
- Patent number 8,076,190
- Issue date Dec 13, 2011
- International Business Machines Corporation
- Howard H. Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Carrier wafer having alignment keys and supporting a chip
- Patent number 8,004,097
- Issue date Aug 23, 2011
- International Business Machines Corporation
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for making coplanar isolated regions of differ...
- Patent number 7,947,566
- Issue date May 24, 2011
- International Business Machines Corporation
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser annealing for 3-D chip integration
- Patent number 7,947,599
- Issue date May 24, 2011
- International Business Machines Corporation
- Howard H. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming co-planar wafer-scale chip packages
- Patent number 7,867,820
- Issue date Jan 11, 2011
- International Business Machines Corporation
- Lloyd G. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for fabricating double-sided SOI wafer scale pack...
- Patent number 7,736,949
- Issue date Jun 15, 2010
- International Business Machines Corporation
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable heavy-ion sensing device for accelerated DRAM soft err...
- Patent number 7,675,789
- Issue date Mar 9, 2010
- International Business Machines Corporation
- Howard H. Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Method to determine the root causes of failure patterns by using sp...
- Patent number 7,676,775
- Issue date Mar 9, 2010
- International Business Machines Corporation
- Howard Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated thermoelectric cooling devices and methods for fabricati...
- Patent number 7,544,883
- Issue date Jun 9, 2009
- International Business Machines Corporation
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling system for a semiconductor device and method of fabricating...
- Patent number 7,528,483
- Issue date May 5, 2009
- International Business Machines Corporation
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable heavy-ion sensing device for accelerated DRAM soft err...
- Patent number 7,499,308
- Issue date Mar 3, 2009
- International Business Machines Corporation
- Howard H. Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Device and method for fabricating double-sided SOI wafer scale pack...
- Patent number 7,489,025
- Issue date Feb 10, 2009
- International Business Machines Corporation
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to achieve precision alignment for wafer scale packages
- Patent number 7,442,579
- Issue date Oct 28, 2008
- International Business Machines Corporation
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming co-planar wafer-scale chip packages
- Patent number 7,405,108
- Issue date Jul 29, 2008
- International Business Machines Corporation
- Lloyd G. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for making coplanar dielectrically-isolated re...
- Patent number 7,399,686
- Issue date Jul 15, 2008
- International Business Machines Corporation
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses for dissipating heat from semiconductor devices
- Patent number 7,369,410
- Issue date May 6, 2008
- International Business Machines Corporation
- Howard Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method and apparatus for making coplanar isolated regions of differ...
- Patent number 7,335,599
- Issue date Feb 26, 2008
- International Business Machines Corporation
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip power supply regulator and temperature control system
- Patent number 7,214,910
- Issue date May 8, 2007
- International Business Machines Corporation
- Howard Hao Chen
- G05 - CONTROLLING REGULATING
Information Patent Grant
Cooling system for a semiconductor device and method of fabricating...
- Patent number 7,170,164
- Issue date Jan 30, 2007
- International Business Machines Corporation
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for fabricating double-sided SOI wafer scale pack...
- Patent number 7,098,070
- Issue date Aug 29, 2006
- International Business Machines Corporation
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuits and methods for matching device characteristics for analog...
- Patent number 7,086,020
- Issue date Aug 1, 2006
- International Business Machines Corporation
- Howard Hao Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling system for a semiconductor device and method of fabricating...
- Patent number 7,029,951
- Issue date Apr 18, 2006
- International Business Machines Corporation
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Global planarization of wafer scale package with precision die thic...
- Patent number 7,005,319
- Issue date Feb 28, 2006
- International Business Machines Corporation
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Narrow-Band Wide-Range Frequency Modulation Continuous Wave (FMCW)...
- Publication number 20120146845
- Publication date Jun 14, 2012
- International Business Machines Corporation
- Howard H. Chen
- G01 - MEASURING TESTING
Information Patent Application
SEA-OF-FINS STRUCTURE ON A SEMICONDUCTOR SUBSTRATE AND METHOD OF FA...
- Publication number 20120043597
- Publication date Feb 23, 2012
- International Business Machines Corporation
- Howard H. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ANNEALING FOR 3-D CHIP INTEGRATION
- Publication number 20110201199
- Publication date Aug 18, 2011
- International Business Machines Corporation
- Howard H. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAKAGE SENSOR AND SWITCH DEVICE FOR DEEP-TRENCH CAPACITOR ARRAY
- Publication number 20110019321
- Publication date Jan 27, 2011
- International Business Machines Corporation
- Howard H. Chen
- G01 - MEASURING TESTING
Information Patent Application
Apparatus for Nonvolatile Multi-Programmable Electronic Fuse System
- Publication number 20110002188
- Publication date Jan 6, 2011
- International Business Machines Corporation
- Howard H. Chen
- G11 - INFORMATION STORAGE
Information Patent Application
CHIP DESIGN AND FABRICATION METHOD OPTIMIZED FOR PROFIT
- Publication number 20100293512
- Publication date Nov 18, 2010
- International Business Machines Corporation
- Nathan Buck
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEA-OF-FINS STRUCTURE OF A SEMICONDUCTOR SUBSTRATE AND METHOD OF FA...
- Publication number 20090309136
- Publication date Dec 17, 2009
- International Business Machines Corporation
- Howard H. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Thermoelectric Cooling Devices and Methods for Fabricati...
- Publication number 20090217961
- Publication date Sep 3, 2009
- International Business Machines Corporation
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ANNEALING FOR 3-D CHIP INTEGRATION
- Publication number 20090184264
- Publication date Jul 23, 2009
- International Business Machines Corporation
- Howard H. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MAKING COPLANAR ISOLATED REGIONS OF DIFFER...
- Publication number 20090121312
- Publication date May 14, 2009
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods to Achieve Precision Alignment for Wafter Scale Packages
- Publication number 20090020891
- Publication date Jan 22, 2009
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR FABRICATING DOUBLE-SIDED SOI WAFER SCALE PACK...
- Publication number 20080318360
- Publication date Dec 25, 2008
- HOWARD HAO CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to Determine the Root Causes of Failure Patterns by Using Sp...
- Publication number 20080301597
- Publication date Dec 4, 2008
- International Business Machines Corporation
- Howard Chen
- G01 - MEASURING TESTING
Information Patent Application
Methods for Forming Co-Planar Wafer-Scale Chip Packages
- Publication number 20080280399
- Publication date Nov 13, 2008
- Lloyd G. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Programmable Heavy-Ion Sensing Device for Accelerated Dram Soft Err...
- Publication number 20080273393
- Publication date Nov 6, 2008
- Howard H. Chen
- G01 - MEASURING TESTING
Information Patent Application
Programmable Heavy-Ion Sensing Device for Accelerated DRAM Soft Err...
- Publication number 20080266984
- Publication date Oct 30, 2008
- International Business Machines Corporation
- Howard H. Chen
- G01 - MEASURING TESTING
Information Patent Application
Apparatuses for Dissipating Heat from Semiconductor Devices
- Publication number 20080170368
- Publication date Jul 17, 2008
- International Business Machines Corporation
- Howard Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Apparatuses for dissipating heat from semiconductor devices
- Publication number 20070258213
- Publication date Nov 8, 2007
- International Business Machines Corporation
- Howard Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Method and apparatus for making coplanar isolated regions of differ...
- Publication number 20070087525
- Publication date Apr 19, 2007
- International Business Machines Corporation
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SYSTEM FOR A SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING...
- Publication number 20070064395
- Publication date Mar 22, 2007
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for making coplanar dielectrically-isolated re...
- Publication number 20070048975
- Publication date Mar 1, 2007
- International Business Machines Corporation
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sea-of-fins structure on a semiconductor substrate and method of fa...
- Publication number 20070018239
- Publication date Jan 25, 2007
- International Business Machines Corporation
- Howard H. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and method for fabricating double-sided SOI wafer scale pack...
- Publication number 20060113598
- Publication date Jun 1, 2006
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods to achieve precision alignment for wafer scale packages
- Publication number 20060110852
- Publication date May 25, 2006
- International Business Machines Corporation
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for forming co-planar wafer-scale chip packages
- Publication number 20060110851
- Publication date May 25, 2006
- International Business Machines Corporation
- Lloyd G. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated thermoelectric cooling devices and methods for fabricati...
- Publication number 20060102223
- Publication date May 18, 2006
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and method for fabricating double-sided SOI wafer scale pack...
- Publication number 20060105496
- Publication date May 18, 2006
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling system for a semiconductor device and method of fabricating...
- Publication number 20060099815
- Publication date May 11, 2006
- Howard Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-chip power supply regulator and temperature control system
- Publication number 20060006166
- Publication date Jan 12, 2006
- Howard Hao Chen
- G05 - CONTROLLING REGULATING
Information Patent Application
Circuits and methods for matching device characteristics for analog...
- Publication number 20050132314
- Publication date Jun 16, 2005
- International Business Machines Corporation
- Howard Hao Chen
- G06 - COMPUTING CALCULATING COUNTING

Howard Hao Chen

Person

Patents Grantslast 30 patents

Sea-of-fins structure on a semiconductor substrate and method of fa...

Narrow-band wide-range frequency modulation continuous wave (FMCW)...

Leakage sensor and switch device for deep-trench capacitor array

Apparatus for nonvolatile multi-programmable electronic fuse system

Laser annealing for 3-D chip integration

Integrated thermoelectric cooling devices and methods for fabricati...

Chip design and fabrication method optimized for profit

Sea-of-fins structure on a semiconductor substrate and method of fa...

Carrier wafer having alignment keys and supporting a chip

Method and apparatus for making coplanar isolated regions of differ...

Laser annealing for 3-D chip integration

Methods for forming co-planar wafer-scale chip packages

Device and method for fabricating double-sided SOI wafer scale pack...

Programmable heavy-ion sensing device for accelerated DRAM soft err...

Method to determine the root causes of failure patterns by using sp...

Integrated thermoelectric cooling devices and methods for fabricati...

Cooling system for a semiconductor device and method of fabricating...

Programmable heavy-ion sensing device for accelerated DRAM soft err...

Device and method for fabricating double-sided SOI wafer scale pack...

Methods to achieve precision alignment for wafer scale packages

Methods for forming co-planar wafer-scale chip packages

Method and apparatus for making coplanar dielectrically-isolated re...

Apparatuses for dissipating heat from semiconductor devices

Method and apparatus for making coplanar isolated regions of differ...

On-chip power supply regulator and temperature control system

Cooling system for a semiconductor device and method of fabricating...

Device and method for fabricating double-sided SOI wafer scale pack...

Circuits and methods for matching device characteristics for analog...

Cooling system for a semiconductor device and method of fabricating...

Global planarization of wafer scale package with precision die thic...

Patents Applicationslast 30 patents

Narrow-Band Wide-Range Frequency Modulation Continuous Wave (FMCW)...

SEA-OF-FINS STRUCTURE ON A SEMICONDUCTOR SUBSTRATE AND METHOD OF FA...

LASER ANNEALING FOR 3-D CHIP INTEGRATION

LEAKAGE SENSOR AND SWITCH DEVICE FOR DEEP-TRENCH CAPACITOR ARRAY

Apparatus for Nonvolatile Multi-Programmable Electronic Fuse System

CHIP DESIGN AND FABRICATION METHOD OPTIMIZED FOR PROFIT

SEA-OF-FINS STRUCTURE OF A SEMICONDUCTOR SUBSTRATE AND METHOD OF FA...

Integrated Thermoelectric Cooling Devices and Methods for Fabricati...

LASER ANNEALING FOR 3-D CHIP INTEGRATION

METHOD AND APPARATUS FOR MAKING COPLANAR ISOLATED REGIONS OF DIFFER...

Methods to Achieve Precision Alignment for Wafter Scale Packages

DEVICE AND METHOD FOR FABRICATING DOUBLE-SIDED SOI WAFER SCALE PACK...

Method to Determine the Root Causes of Failure Patterns by Using Sp...

Methods for Forming Co-Planar Wafer-Scale Chip Packages

Programmable Heavy-Ion Sensing Device for Accelerated Dram Soft Err...

Programmable Heavy-Ion Sensing Device for Accelerated DRAM Soft Err...

Apparatuses for Dissipating Heat from Semiconductor Devices

Apparatuses for dissipating heat from semiconductor devices

Method and apparatus for making coplanar isolated regions of differ...

COOLING SYSTEM FOR A SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING...

Method and apparatus for making coplanar dielectrically-isolated re...

Sea-of-fins structure on a semiconductor substrate and method of fa...

Device and method for fabricating double-sided SOI wafer scale pack...

Methods to achieve precision alignment for wafer scale packages

Methods for forming co-planar wafer-scale chip packages

Integrated thermoelectric cooling devices and methods for fabricati...

Device and method for fabricating double-sided SOI wafer scale pack...

Cooling system for a semiconductor device and method of fabricating...

On-chip power supply regulator and temperature control system

Circuits and methods for matching device characteristics for analog...