Howard Lee Marks

Person

Gilroy, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interlocked redistribution layer interface for flip-chip integrated...
- Patent number 11,545,450
- Issue date Jan 3, 2023
- NVIDIA Corporation
- Yuanjing Jane Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a flip chip semiconductor die with internal s...
- Patent number 8,951,814
- Issue date Feb 10, 2015
- NVIDIA Corporation
- Brian S. Schieck
- G01 - MEASURING TESTING
Information Patent Grant
Flip chip semiconductor die internal signal access system and method
- Patent number 8,357,931
- Issue date Jan 22, 2013
- NVIDIA Corporation
- Brian S. Schieck
- G01 - MEASURING TESTING
Information Patent Grant
Method of fabricating a pad over active circuit I.C. with frame sup...
- Patent number 8,017,520
- Issue date Sep 13, 2011
- NVIDIA Corporation
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip semiconductor die internal signal access system and method
- Patent number 7,842,948
- Issue date Nov 30, 2010
- NVIDIA Corporation
- Brian S. Schieck
- G01 - MEASURING TESTING
Information Patent Grant
Pad over active circuit system and method with meshed support struc...
- Patent number 7,791,193
- Issue date Sep 7, 2010
- NVIDIA Corporation
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad over active circuit system and method with frame support structure
- Patent number 7,649,269
- Issue date Jan 19, 2010
- NVIDIA Corporation
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad over active circuit system and method with frame support structure
- Patent number 7,495,343
- Issue date Feb 24, 2009
- NVIDIA Corporation
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad over active circuit system and method with meshed support struc...
- Patent number 7,453,158
- Issue date Nov 18, 2008
- NVIDIA Corporation
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a pad over active circuit I.C. with meshed su...
- Patent number 7,429,528
- Issue date Sep 30, 2008
- NVIDIA Corporation
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW STRESS PLANE DESIGN FOR IC PACKAGE SUBSTRATE
- Publication number 20230103147
- Publication date Mar 30, 2023
- NVIDIA Corporation
- Yuanjing Jane Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERLOCKED REDISTRIBUTION LAYER INTERFACE FOR FLIP-CHIP INTEGRATED...
- Publication number 20220020709
- Publication date Jan 20, 2022
- NVIDIA Corporation
- Yuanjing Jane Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SEMICONDUCTOR DIE INTERNAL SIGNAL ACCESS SYSTEM AND METHOD
- Publication number 20130221354
- Publication date Aug 29, 2013
- NVIDIA Corporation
- Brian S. Schieck
- G01 - MEASURING TESTING
Information Patent Application
Flip chip semiconductor die internal signal access system and method
- Publication number 20080128695
- Publication date Jun 5, 2008
- Brian S. Schieck
- G01 - MEASURING TESTING
Information Patent Application
PAD OVER ACTIVE CIRCUIT SYSTEM AND METHOD WITH MESHED SUPPORT STRUC...
- Publication number 20080067687
- Publication date Mar 20, 2008
- NVIDIA CORPORATION
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD OVER ACTIVE CIRCUIT SYSTEM AND METHOD WITH FRAME SUPPORT STRUCTURE
- Publication number 20080062623
- Publication date Mar 13, 2008
- NVIDIA CORPORATION
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip semiconductor die internal signal access system and method
- Publication number 20050191770
- Publication date Sep 1, 2005
- Brian S. Schieck
- G01 - MEASURING TESTING
Information Patent Application
Method of fabricating a pad over active circuit I.C. with meshed su...
- Publication number 20050164484
- Publication date Jul 28, 2005
- NVIDIA CORPORATION
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating a pad over active circuit I.C. with frame sup...
- Publication number 20050146012
- Publication date Jul 7, 2005
- NVIDIA CORPORATION
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad over active circuit system and method with meshed support struc...
- Publication number 20050023700
- Publication date Feb 3, 2005
- NVIDIA CORPORATION
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS

Howard Lee Marks

Person

Patents Grantslast 30 patents

Interlocked redistribution layer interface for flip-chip integrated...

Method of fabricating a flip chip semiconductor die with internal s...

Flip chip semiconductor die internal signal access system and method

Method of fabricating a pad over active circuit I.C. with frame sup...

Flip chip semiconductor die internal signal access system and method

Pad over active circuit system and method with meshed support struc...

Pad over active circuit system and method with frame support structure

Pad over active circuit system and method with frame support structure

Pad over active circuit system and method with meshed support struc...

Method of fabricating a pad over active circuit I.C. with meshed su...

Patents Applicationslast 30 patents

LOW STRESS PLANE DESIGN FOR IC PACKAGE SUBSTRATE

INTERLOCKED REDISTRIBUTION LAYER INTERFACE FOR FLIP-CHIP INTEGRATED...

FLIP CHIP SEMICONDUCTOR DIE INTERNAL SIGNAL ACCESS SYSTEM AND METHOD

Flip chip semiconductor die internal signal access system and method

PAD OVER ACTIVE CIRCUIT SYSTEM AND METHOD WITH MESHED SUPPORT STRUC...

PAD OVER ACTIVE CIRCUIT SYSTEM AND METHOD WITH FRAME SUPPORT STRUCTURE

Flip chip semiconductor die internal signal access system and method

Method of fabricating a pad over active circuit I.C. with meshed su...

Method of fabricating a pad over active circuit I.C. with frame sup...

Pad over active circuit system and method with meshed support struc...