Howard Terry Glascock

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Graham, NC, US

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Patents Grantslast 30 patents

Information Patent Grant
Low pressure encapsulant for size-reduced semiconductor package
- Patent number 9,646,857
- Issue date May 9, 2017
- Qorvo US, Inc.
- Howard Terry Glascock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin flip-chip packaging techniques and configurations
- Patent number 9,269,887
- Issue date Feb 23, 2016
- TriQuint Semiconductor, Inc.
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPARTMENTALIZED SHIELDING OF A MODULE UTILIZING SELF-SHIELDED SUB...
- Publication number 20230247814
- Publication date Aug 3, 2023
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH SOLDER INTERCONNECT AND MULTIPLE MATERIAL EN...
- Publication number 20220052667
- Publication date Feb 17, 2022
- Qorvo US, Inc.
- Charles E. Carpenter
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
LOW PRESSURE ENCAPSULANT FOR SIZE-REDUCED SEMICONDUCTOR PACKAGE
- Publication number 20170047232
- Publication date Feb 16, 2017
- Qorvo US, Inc.
- Howard Terry Glascock
- H01 - BASIC ELECTRIC ELEMENTS