Howe Yin Loo

Person

Sungai Petani, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Micro-hinge for an electronic device
- Patent number 11,639,623
- Issue date May 2, 2023
- Intel Corporation
- Bok Eng Cheah
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Grant
Device, method and system for providing recessed interconnect struc...
- Patent number 11,355,427
- Issue date Jun 7, 2022
- Intel Corporation
- Howe Yin Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional decoupling integration within hole in motherboard
- Patent number 11,006,514
- Issue date May 11, 2021
- Intel Corporation
- Jia Yan Go
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stacked-in-recess system in package
- Patent number 10,943,792
- Issue date Mar 9, 2021
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extended stiffener for platform miniaturization
- Patent number 10,643,983
- Issue date May 5, 2020
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-hinge for an electronic device
- Patent number 10,633,898
- Issue date Apr 28, 2020
- Intel Corporation
- Bok Eng Cheah
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Grant
Multi-orientation display device
- Patent number 10,503,211
- Issue date Dec 10, 2019
- Intel Corporation
- Chee Chun Yee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wearable electronic devices and components thereof
- Patent number 10,394,280
- Issue date Aug 27, 2019
- Intel Corporation
- Thorsten Meyer
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Package-bottom through-mold via interposers for land-side configure...
- Patent number 10,153,253
- Issue date Dec 11, 2018
- Intel Corporation
- Howe Yin Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device attachment on a reverse microelectronic package
- Patent number 10,136,516
- Issue date Nov 20, 2018
- Intel Corporation
- Howe Yin Loo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductor interconnect
- Patent number 10,083,922
- Issue date Sep 25, 2018
- Intel Corporation
- Min Suet Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device having an air core inductor
- Patent number 10,085,342
- Issue date Sep 25, 2018
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-hinge for an electronic device
- Patent number 10,041,282
- Issue date Aug 7, 2018
- Intel Corporation
- Bok Eng Cheah
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Grant
Micro-hinge for an electronic device
- Patent number 10,036,187
- Issue date Jul 31, 2018
- Intel Corporation
- Bok Eng Cheah
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Grant
Micro-hinge for an electronic device
- Patent number 10,000,953
- Issue date Jun 19, 2018
- Intel Corporation
- Bok Eng Cheah
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Grant
Micro-hinge for an electronic device
- Patent number 10,000,954
- Issue date Jun 19, 2018
- Intel Corporation
- Bok Eng Cheah
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Grant
Wearable electronic devices and components thereof
- Patent number 9,904,321
- Issue date Feb 27, 2018
- Intel Corporation
- Thorsten Meyer
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Microelectronic device attachment on a reverse microelectronic package
- Patent number 9,699,904
- Issue date Jul 4, 2017
- Intel Corporation
- Howe Yin Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with flexible hinge
- Patent number D773452
- Issue date Dec 6, 2016
- Intel Corporation
- Bok Eng Cheah
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Computer on a stick
- Patent number D759029
- Issue date Jun 14, 2016
- Intel Corporation
- Howe Yin Loo
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Low-profile hinge for an electronic device
- Patent number 9,360,896
- Issue date Jun 7, 2016
- Intel Corporation
- Min Suet Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Portable computing device with low profile hinge
- Patent number D756349
- Issue date May 17, 2016
- Intel Corporation
- Min Suet Lim
- D14 - Recording, communication, or information retrieval equipment

Patents Applicationslast 30 patents

Information Patent Application
LAPTOP ARRANGEMENT FOR HEAT CONTROL
- Publication number 20240147654
- Publication date May 2, 2024
- Intel Corporation
- Jiunn Shyong CHEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPOSITE PRINTED CIRCUIT BOARDS AND DEVICES
- Publication number 20240006786
- Publication date Jan 4, 2024
- Intel Corporation
- Howe Yin LOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ORIENTATION DISPLAY DEVICE
- Publication number 20230409084
- Publication date Dec 21, 2023
- Intel Corporation
- Chee Chun Yee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EXPANDABLE THERMAL SOLUTION FOR LAPTOPS
- Publication number 20210333848
- Publication date Oct 28, 2021
- Intel Corporation
- Jeff KU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MICRO-HINGE FOR AN ELECTRONIC DEVICE
- Publication number 20200325711
- Publication date Oct 15, 2020
- Intel Corporation
- Bok Eng Cheah
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Application
MULTI-ORIENTATION DISPLAY DEVICE
- Publication number 20200192432
- Publication date Jun 18, 2020
- Intel Corporation
- Chee Chun Yee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE-DIMENSIONAL DECOUPLING INTEGRATION WITHIN HOLE IN MOTHERBOARD
- Publication number 20190394871
- Publication date Dec 26, 2019
- Intel Corporation
- Jia Yan GO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACKED-IN-RECESS SYSTEM IN PACKAGE
- Publication number 20190206698
- Publication date Jul 4, 2019
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, METHOD AND SYSTEM FOR PROVIDING RECESSED INTERCONNECT STRUC...
- Publication number 20190131227
- Publication date May 2, 2019
- Intel Corporation
- Howe Yin LOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-HINGE FOR AN ELECTRONIC DEVICE
- Publication number 20190093402
- Publication date Mar 28, 2019
- Intel Corporation
- Bok Eng Cheah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EXTENDED STIFFENER FOR PLATFORM MINIATURIZATION
- Publication number 20190013303
- Publication date Jan 10, 2019
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-BOTTOM INTERPOSERS FOR LAND-SIDE CONFIGURED DEVICES FOR SYS...
- Publication number 20180175002
- Publication date Jun 21, 2018
- Intel Corporation
- Howe Yin Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE HAVING AN AIR CORE INDUCTOR
- Publication number 20180168043
- Publication date Jun 14, 2018
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEARABLE ELECTRONIC DEVICES AND COMPONENTS THEREOF
- Publication number 20180157289
- Publication date Jun 7, 2018
- Intel Corporation
- Thorsten Meyer
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PACKAGE-BOTTOM THROUGH-MOLD VIA INTERPOSERS FOR LAND-SIDE CONFIGURE...
- Publication number 20180145051
- Publication date May 24, 2018
- Intel Corporation
- Howe Yin Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR INTERCONNECT
- Publication number 20180145042
- Publication date May 24, 2018
- Intel Corporation
- Min Suet Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ATTACHMENT ON A REVERSE MICROELECTRONIC PACKAGE
- Publication number 20170265306
- Publication date Sep 14, 2017
- Intel Corporation
- Howe Yin Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ORIENTATION DISPLAY DEVICE
- Publication number 20170075388
- Publication date Mar 16, 2017
- Intel Corporation
- Chee Chun Yee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WEARABLE ELECTRONIC DEVICES AND COMPONENTS THEREOF
- Publication number 20160274621
- Publication date Sep 22, 2016
- Intel Corporation
- Thorsten Meyer
- G02 - OPTICS
Information Patent Application
Micro-hinge for an electronic device
- Publication number 20160130849
- Publication date May 12, 2016
- Intel Corporation
- Bok Eng Cheah
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Application
MICRO-HINGE FOR AN ELECTRONIC DEVICE
- Publication number 20160132077
- Publication date May 12, 2016
- Intel Corporation
- Bok Eng Cheah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICRO-HINGE FOR AN ELECTRONIC DEVICE
- Publication number 20150277506
- Publication date Oct 1, 2015
- Bok Eng Cheah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOW-PROFILE HINGE FOR AN ELECTRONIC DEVICE
- Publication number 20150277505
- Publication date Oct 1, 2015
- Intel Corporation
- Min Suet Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC DEVICE ATTACHMENT ON A REVERSE MICROELECTRONIC PACKAGE
- Publication number 20140293563
- Publication date Oct 2, 2014
- Howe Yin Loo
- H01 - BASIC ELECTRIC ELEMENTS

Howe Yin Loo

Person

Patents Grantslast 30 patents

Micro-hinge for an electronic device

Device, method and system for providing recessed interconnect struc...

Three-dimensional decoupling integration within hole in motherboard

3D stacked-in-recess system in package

Extended stiffener for platform miniaturization

Micro-hinge for an electronic device

Multi-orientation display device

Wearable electronic devices and components thereof

Package-bottom through-mold via interposers for land-side configure...

Microelectronic device attachment on a reverse microelectronic package

Inductor interconnect

Microelectronic device having an air core inductor

Micro-hinge for an electronic device

Micro-hinge for an electronic device

Micro-hinge for an electronic device

Micro-hinge for an electronic device

Wearable electronic devices and components thereof

Microelectronic device attachment on a reverse microelectronic package

Electronic device with flexible hinge

Computer on a stick

Low-profile hinge for an electronic device

Portable computing device with low profile hinge

Patents Applicationslast 30 patents

LAPTOP ARRANGEMENT FOR HEAT CONTROL

COMPOSITE PRINTED CIRCUIT BOARDS AND DEVICES

MULTI-ORIENTATION DISPLAY DEVICE

EXPANDABLE THERMAL SOLUTION FOR LAPTOPS

MICRO-HINGE FOR AN ELECTRONIC DEVICE

MULTI-ORIENTATION DISPLAY DEVICE

THREE-DIMENSIONAL DECOUPLING INTEGRATION WITHIN HOLE IN MOTHERBOARD

3D STACKED-IN-RECESS SYSTEM IN PACKAGE

DEVICE, METHOD AND SYSTEM FOR PROVIDING RECESSED INTERCONNECT STRUC...

MICRO-HINGE FOR AN ELECTRONIC DEVICE

EXTENDED STIFFENER FOR PLATFORM MINIATURIZATION

PACKAGE-BOTTOM INTERPOSERS FOR LAND-SIDE CONFIGURED DEVICES FOR SYS...

MICROELECTRONIC DEVICE HAVING AN AIR CORE INDUCTOR

WEARABLE ELECTRONIC DEVICES AND COMPONENTS THEREOF

PACKAGE-BOTTOM THROUGH-MOLD VIA INTERPOSERS FOR LAND-SIDE CONFIGURE...

INDUCTOR INTERCONNECT

MICROELECTRONIC DEVICE ATTACHMENT ON A REVERSE MICROELECTRONIC PACKAGE

MULTI-ORIENTATION DISPLAY DEVICE

WEARABLE ELECTRONIC DEVICES AND COMPONENTS THEREOF

Micro-hinge for an electronic device

MICRO-HINGE FOR AN ELECTRONIC DEVICE

MICRO-HINGE FOR AN ELECTRONIC DEVICE

LOW-PROFILE HINGE FOR AN ELECTRONIC DEVICE

MICROELECTRONIC DEVICE ATTACHMENT ON A REVERSE MICROELECTRONIC PACKAGE