Hsaing-Pin Kuan

Follow

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package and method of forming the same
- Patent number 11,031,376
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsaing-Pin Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,879,192
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsaing-Pin Kuan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240047446
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210020581
- Publication date Jan 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsaing-Pin Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20210020607
- Publication date Jan 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsaing-Pin Kuan
- H01 - BASIC ELECTRIC ELEMENTS