Hsi-Chen Yang

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Taichung County, TW

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Patents Grantslast 30 patents

Information Patent Grant
Package structure of a microphone
- Patent number 7,884,467
- Issue date Feb 8, 2011
- Lingsen Precision Industries, Ltd.
- Chin-Ching Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING PASSAGE IN SUBSTRATE FOR MEMS MODULE
- Publication number 20090020501
- Publication date Jan 22, 2009
- Lingsen Precision Industries
- Chiung-Yueh TIEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FORMING PASSAGE THROUGH SUBSTRATE FOR MEMS MODULE
- Publication number 20090020500
- Publication date Jan 22, 2009
- Lingsen Precision Industries, Ltd.
- Chiung-Yueh TIEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Package structure of a microphone
- Publication number 20080285784
- Publication date Nov 20, 2008
- Chin-Ching Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Package structure of a microphone
- Publication number 20070182002
- Publication date Aug 9, 2007
- Chin-Ching Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE