Hsi-Chuan Cheng

Person

Tainan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Modified chemokine peptide and use thereof
- Patent number 12,329,804
- Issue date Jun 17, 2025
- RISE BIOPHARMACEUTICALS INC.
- Jya-Wei Cheng
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Lthc as charging barrier in info package formation
- Patent number 12,334,489
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 12,261,074
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pharmaceutical compositions and use thereof for relieving anticance...
- Patent number 12,226,454
- Issue date Feb 18, 2025
- RISE BIOPHARMACEUTICALS INC.
- Jya-Wei Cheng
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 12,051,634
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure
- Patent number 12,046,588
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Dong-Han Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,990,454
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 11,984,342
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,948,881
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LTHC as charging barrier in info package formation
- Patent number 11,923,353
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 11,756,849
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LTHC as charging barrier in InFO package formation
- Patent number 11,437,361
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 11,404,341
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure
- Patent number 11,257,797
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Dong-Han Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and manufacturing method
- Patent number 11,217,548
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Guo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming bump structure
- Patent number 11,145,613
- Issue date Oct 12, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Guo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,069,614
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 10,950,478
- Issue date Mar 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 10,867,973
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor structure
- Patent number 10,692,809
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical conducti...
- Patent number 10,573,573
- Issue date Feb 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure
- Patent number 10,546,845
- Issue date Jan 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Dong-Han Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 10,529,697
- Issue date Jan 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LTHC as charging barrier in InFO package formation
- Patent number 10,522,526
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device and method of manufacturing the same
- Patent number 10,290,590
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 10,290,530
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and manufacturing method
- Patent number 10,163,843
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Guo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 10,128,182
- Issue date Nov 13, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and method for forming the same
- Patent number 10,090,267
- Issue date Oct 2, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Guo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder stud structure
- Patent number 9,997,482
- Issue date Jun 12, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Guo Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
- Publication number 20250201617
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE STRUCTURE
- Publication number 20240355795
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dong-Han Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240266336
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION
- Publication number 20240222352
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Col., Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND PACKAGE-ON-PACKAGE STRUCTURE HAVING ELLIPTICAL COLUMNS...
- Publication number 20230369152
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Info Structure with Copper Pillar Having Reversed Profile
- Publication number 20230335426
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION
- Publication number 20220399325
- Publication date Dec 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND PACKAGE-ON-PACKAGE STRUCTURE HAVING ELLIPTICAL COLUMNS...
- Publication number 20220301964
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE STRUCTURE
- Publication number 20220173083
- Publication date Jun 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dong-Han Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20210335708
- Publication date Oct 28, 2021
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- HSI-KUEI CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Info Structure with Copper Pillar Having Reversed Profile
- Publication number 20210202290
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHARMACEUTICAL COMPOSITIONS AND USE THEREOF FOR RELIEVING RESISTANC...
- Publication number 20210128683
- Publication date May 6, 2021
- Rise Biopharmaceuticals Inc.
- Jya-Wei CHENG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Package Structure and Method of Forming the Same
- Publication number 20210098434
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHARMACEUTICAL COMPOSITIONS AND USE THEREOF FOR RELIEVING ANTICANCE...
- Publication number 20210060130
- Publication date Mar 4, 2021
- Rise Biopharmaceuticals Inc.
- Jya-Wei CHENG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MODIFIED CHEMOKINE PEPTIDE AND USE THEREOF
- Publication number 20210046158
- Publication date Feb 18, 2021
- Rise Biopharmaceuticals Inc.
- Jya-Wei CHENG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20200273795
- Publication date Aug 27, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- HSI-KUEI CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE, PACKAGE-ON-PACKAGE STRUCTURE, AND METHOD OF MANUFACTURING...
- Publication number 20200194326
- Publication date Jun 18, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE STRUCTURE
- Publication number 20200091122
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Dong-Han Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LTHC as Charging Barrier in InFO Package Formation
- Publication number 20200006312
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE STRUCTURE
- Publication number 20190326264
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Dong-Han Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE, PACKAGE-ON-PACKAGE STRUCTURE, AND METHOD OF MANUFACTURING...
- Publication number 20190295913
- Publication date Sep 26, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Info Structure with Copper Pillar Having Reversed Profile
- Publication number 20190267274
- Publication date Aug 29, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Structure and Manufacturing Method
- Publication number 20190131264
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Li-Guo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190074248
- Publication date Mar 7, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- HSI-KUEI CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LTHC as Charging Barrier in InFO Package Formation
- Publication number 20190035774
- Publication date Jan 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING BUMP STRUCTURE
- Publication number 20190019772
- Publication date Jan 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Guo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Method of Forming the Same
- Publication number 20180350784
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Info Structure with Copper Pillar Having Reversed Profile
- Publication number 20180174937
- Publication date Jun 21, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180151512
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- SHIN-PUU JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED CHEMOKINE PEPTIDE
- Publication number 20180125938
- Publication date May 10, 2018
- Jya-Wei CHENG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Hsi-Chuan Cheng

Person

Patents Grantslast 30 patents

Modified chemokine peptide and use thereof

Lthc as charging barrier in info package formation

Info structure with copper pillar having reversed profile

Pharmaceutical compositions and use thereof for relieving anticance...

Package and package-on-package structure having elliptical columns...

Package on package structure

Package structure and method of forming the same

Info structure with copper pillar having reversed profile

Semiconductor structure

LTHC as charging barrier in info package formation

Package and package-on-package structure having elliptical columns...

LTHC as charging barrier in InFO package formation

Package and package-on-package structure having elliptical columns...

Package on package structure

Semiconductor device structure and manufacturing method

Method for forming bump structure

Semiconductor package structure

Info structure with copper pillar having reversed profile

Package structure and method of forming the same

Manufacturing method for semiconductor structure

Package and package-on-package structure having elliptical conducti...

Package on package structure

Package structure and method of forming the same

LTHC as charging barrier in InFO package formation

Stacked semiconductor device and method of manufacturing the same

Info structure with copper pillar having reversed profile

Semiconductor device structure and manufacturing method

Semiconductor package structure and manufacturing method thereof

Bump structure and method for forming the same

Solder stud structure

Patents Applicationslast 30 patents

INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE

PACKAGE ON PACKAGE STRUCTURE

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION

PACKAGE AND PACKAGE-ON-PACKAGE STRUCTURE HAVING ELLIPTICAL COLUMNS...

Info Structure with Copper Pillar Having Reversed Profile

LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION

PACKAGE AND PACKAGE-ON-PACKAGE STRUCTURE HAVING ELLIPTICAL COLUMNS...

PACKAGE ON PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE

Info Structure with Copper Pillar Having Reversed Profile

PHARMACEUTICAL COMPOSITIONS AND USE THEREOF FOR RELIEVING RESISTANC...

Package Structure and Method of Forming the Same

PHARMACEUTICAL COMPOSITIONS AND USE THEREOF FOR RELIEVING ANTICANCE...

MODIFIED CHEMOKINE PEPTIDE AND USE THEREOF

SEMICONDUCTOR STRUCTURE

PACKAGE, PACKAGE-ON-PACKAGE STRUCTURE, AND METHOD OF MANUFACTURING...

PACKAGE ON PACKAGE STRUCTURE

LTHC as Charging Barrier in InFO Package Formation

PACKAGE ON PACKAGE STRUCTURE

PACKAGE, PACKAGE-ON-PACKAGE STRUCTURE, AND METHOD OF MANUFACTURING...

Info Structure with Copper Pillar Having Reversed Profile

Semiconductor Device Structure and Manufacturing Method

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

LTHC as Charging Barrier in InFO Package Formation

METHOD FOR FORMING BUMP STRUCTURE

Package Structure and Method of Forming the Same

Info Structure with Copper Pillar Having Reversed Profile

STACKED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

MODIFIED CHEMOKINE PEPTIDE