HSI-YING YUAN

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Hsinchu County, TW

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Patents Grantslast 30 patents

Information Patent Grant
Embedded substrate package structure
- Patent number 10,115,673
- Issue date Oct 30, 2018
- Sung-Lien He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for integrating microfluidic devices and electrical biose...
- Patent number 9,810,662
- Issue date Nov 7, 2017
- CHIP WIN TECHNOLOGY CO., LTD.
- Chao-Ching Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED SUBSTRATE PACKAGE STRUCTURE
- Publication number 20180315712
- Publication date Nov 1, 2018
- Holien Technology Co., LTD.
- Sung-Lien He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180166390
- Publication date Jun 14, 2018
- CHIP WIN TECHNOLOGY CO., LTD.
- Chao-Ching Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRUCTURE FOR INTEGRATING MICROFLUIDIC DEVICES AND OPTICAL BIOSENSORS
- Publication number 20170282186
- Publication date Oct 5, 2017
- CHIP WIN TECHNOLOGY CO., LTD.
- CHAO-CHING YU
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL