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Hsi-Ying Yuan
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Taoyuan City, TW
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Patents Grants
last 30 patents
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Patent Grant
Method for forming filling paste structure of WL package
Patent number
7,476,565
Issue date
Jan 13, 2009
Advanced Chip Engineering Technology Inc.
Wen-Kun Yang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Filling paste structure and process for WL-CSP
Publication number
20080044945
Publication date
Feb 21, 2008
Advanced Chip Engineering Technology Inc.
Wen-Kun Yang
H01 - BASIC ELECTRIC ELEMENTS