Hsiang-Chung HSU

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Diode package structure and manufacturing method thereof
- Patent number 12,040,434
- Issue date Jul 16, 2024
- Lextar Electronics Corporation
- Yu-Jing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure
- Patent number 11,588,010
- Issue date Feb 21, 2023
- Realtek Semiconductor Corporation
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240339572
- Publication date Oct 10, 2024
- Lextar Electronics Corporation
- Yu-Jing FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE
- Publication number 20210091173
- Publication date Mar 25, 2021
- REALTEK SEMICONDUCTOR CORPORATION
- Hsiao-Tsung YEN
- H01 - BASIC ELECTRIC ELEMENTS