Hsiang-Hua Huang

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Taichung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board having a sacrificial pad to mitigate galvanic...
- Patent number 12,193,166
- Issue date Jan 7, 2025
- SanDisk Technologies, Inc.
- Songtao Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including contact fingers on opposed surfaces
- Patent number 11,139,277
- Issue date Oct 5, 2021
- Western Digital Technologies, Inc.
- Chien Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic package
- Patent number 10,763,237
- Issue date Sep 1, 2020
- Siliconware Precision Industries Co., Ltd.
- Yu-Min Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic package
- Patent number 10,522,500
- Issue date Dec 31, 2019
- Siliconware Precision Industries Co., Ltd.
- Yu-Min Lo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240373545
- Publication date Nov 7, 2024
- Siliconware Precision Industries Co., Ltd.
- Hsiang-Hua HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD HAVING A SACRIFICIAL PAD TO MITIGATE GALVANIC...
- Publication number 20230337372
- Publication date Oct 19, 2023
- Western Digital Technologies, Inc.
- Songtao Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONTACT FINGERS ON OPPOSED SURFACES
- Publication number 20200411478
- Publication date Dec 31, 2020
- Western Digital Technologies, Inc.
- Chien Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC PACKAGE
- Publication number 20200091109
- Publication date Mar 19, 2020
- Siliconware Precision Industries Co., Ltd.
- Yu-Min Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC PACKAGE
- Publication number 20190252344
- Publication date Aug 15, 2019
- Siliconware Precision Industries Co., Ltd.
- Yu-Min Lo
- H01 - BASIC ELECTRIC ELEMENTS