Hsiang-Huan Lee

Person

Jhudong Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,165,990
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 11,916,023
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective formation of conductor nanowires
- Patent number 11,908,789
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,587,886
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with embedded heat dissipation features
- Patent number 11,133,237
- Issue date Sep 28, 2021
- Taiwan Semiconductor Manufacturing Company
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,037,852
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of semiconductor integrated circuit fabrication
- Patent number 10,930,552
- Issue date Feb 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 10,867,951
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 10,770,405
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 10,707,177
- Issue date Jul 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with embedded heat dissipation features
- Patent number 10,629,510
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,629,545
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective formation of conductor nanowires
- Patent number 10,490,497
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 10,461,009
- Issue date Oct 29, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of semiconductor integrated circuit fabrication
- Patent number 10,453,746
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Copper etching integration scheme
- Patent number 10,354,954
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,340,242
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 10,157,813
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,121,698
- Issue date Nov 6, 2018
- Taiwan Semiconductor Manufacturing Company
- Hsiang-Huan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper etching integration scheme
- Patent number 10,020,259
- Issue date Jul 10, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithography using high selectivity spacers for pitch reduction
- Patent number 10,014,175
- Issue date Jul 3, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with embedded heat dissipation features
- Patent number 9,978,660
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Company
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of semiconductor integrated circuit fabrication
- Patent number 9,947,583
- Issue date Apr 17, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithography using multilayer spacer for reduced spacer footing
- Patent number 9,892,933
- Issue date Feb 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnection
- Patent number 9,842,767
- Issue date Dec 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 9,837,310
- Issue date Dec 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and manufacturing method thereof
- Patent number 9,818,644
- Issue date Nov 14, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithography using high selectivity spacers for pitch reduction
- Patent number 9,773,676
- Issue date Sep 26, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 9,735,082
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via pre-fill on back-end-of-the-line interconnect layer
- Patent number 9,728,503
- Issue date Aug 8, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES
- Publication number 20240162166
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Formation of Conductor Nanowires
- Publication number 20240153870
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230178498
- Publication date Jun 8, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- KUAN-YU HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Packaging with Hot Spot Thermal Management Features
- Publication number 20210287956
- Publication date Sep 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Interface Material Having Different Thicknesses in Packages
- Publication number 20200402926
- Publication date Dec 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH EMBEDDED HEAT DISSIPATION FEATURES
- Publication number 20200251398
- Publication date Aug 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200251427
- Publication date Aug 6, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- KUAN-YU HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Formation of Conductor Nanowires
- Publication number 20200091068
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Semiconductor Integrated Circuit Fabrication
- Publication number 20200051857
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- B82 - NANO-TECHNOLOGY
Information Patent Application
3DIC Packaging with Hot Spot Thermal Management Features
- Publication number 20200027809
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190244925
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- KUAN-YU HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Packaging with Hot Spot Thermal Management Features
- Publication number 20190096781
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190067231
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- KUAN-YU HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Interface Material Having Different Thicknesses In Packages
- Publication number 20180350754
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Interface Material Having Different Thicknesses in Packages
- Publication number 20180350755
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ETCHING INTEGRATION SCHEME
- Publication number 20180301416
- Publication date Oct 18, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Embedded Heat Dissipation Features
- Publication number 20180269127
- Publication date Sep 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180261554
- Publication date Sep 13, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- KUAN-YU HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Semiconductor Integrated Circuit Fabrication
- Publication number 20180233406
- Publication date Aug 16, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lithography Using High Selectivity Spacers for Pitch Reduction
- Publication number 20180012761
- Publication date Jan 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Packaging with Hot Spot Thermal Management Features
- Publication number 20170345732
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Via Plating with Seed Layer
- Publication number 20170236750
- Publication date Aug 17, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi Yang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ETCHING INTEGRATION SCHEME
- Publication number 20170194258
- Publication date Jul 6, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Semiconductor Integrated Circuit Fabrication
- Publication number 20170170066
- Publication date Jun 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Metallization Systems and Methods
- Publication number 20170125290
- Publication date May 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Huan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Element Structure and Method
- Publication number 20160358817
- Publication date Dec 8, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ETCHING INTEGRATION SCHEME
- Publication number 20160254225
- Publication date Sep 1, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Via Plating with Seed Layer
- Publication number 20160240434
- Publication date Aug 18, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20160218035
- Publication date Jul 28, 2016
- Taiwan Semiconductor Manufacturing company Ltd.
- SHIN-YI YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Metallization Systems and Methods
- Publication number 20160181152
- Publication date Jun 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Huan Lee
- H01 - BASIC ELECTRIC ELEMENTS

Hsiang-Huan Lee

Person

Patents Grantslast 30 patents

Semiconductor device

Thermal interface material having different thicknesses in packages

Selective formation of conductor nanowires

Semiconductor device

Package with embedded heat dissipation features

3DIC packaging with hot spot thermal management features

Method of semiconductor integrated circuit fabrication

Semiconductor device

Thermal interface material having different thicknesses in packages

Thermal interface material having different thicknesses in packages

Package with embedded heat dissipation features

Semiconductor device

Selective formation of conductor nanowires

3DIC packaging with hot spot thermal management features

Method of semiconductor integrated circuit fabrication

Copper etching integration scheme

Semiconductor device and method of manufacturing the same

3DIC packaging with hot spot thermal management features

Method of manufacturing a semiconductor device

Copper etching integration scheme

Lithography using high selectivity spacers for pitch reduction

Package with embedded heat dissipation features

Method of semiconductor integrated circuit fabrication

Lithography using multilayer spacer for reduced spacer footing

Method of forming an interconnection

Method of manufacturing a semiconductor device

Interconnect structure and manufacturing method thereof

Lithography using high selectivity spacers for pitch reduction

3DIC packaging with hot spot thermal management features

Via pre-fill on back-end-of-the-line interconnect layer

Patents Applicationslast 30 patents

THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES

Selective Formation of Conductor Nanowires

SEMICONDUCTOR DEVICE

3DIC Packaging with Hot Spot Thermal Management Features

Thermal Interface Material Having Different Thicknesses in Packages

PACKAGE WITH EMBEDDED HEAT DISSIPATION FEATURES

SEMICONDUCTOR DEVICE

Selective Formation of Conductor Nanowires

Method of Semiconductor Integrated Circuit Fabrication

3DIC Packaging with Hot Spot Thermal Management Features

SEMICONDUCTOR DEVICE

3DIC Packaging with Hot Spot Thermal Management Features

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Thermal Interface Material Having Different Thicknesses In Packages

Thermal Interface Material Having Different Thicknesses in Packages

COPPER ETCHING INTEGRATION SCHEME

Package with Embedded Heat Dissipation Features

SEMICONDUCTOR DEVICE

Method of Semiconductor Integrated Circuit Fabrication

Lithography Using High Selectivity Spacers for Pitch Reduction

3DIC Packaging with Hot Spot Thermal Management Features

Method for Via Plating with Seed Layer

COPPER ETCHING INTEGRATION SCHEME

Method of Semiconductor Integrated Circuit Fabrication

Semiconductor Device Metallization Systems and Methods

Conductive Element Structure and Method

COPPER ETCHING INTEGRATION SCHEME

Method for Via Plating with Seed Layer

INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor Device Metallization Systems and Methods