Hsiang Wan Liau

Follow

Person

Gelugor, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Void reduction in indium thermal interface material
- Patent number 7,999,394
- Issue date Aug 16, 2011
- Advanced Micro Devices, Inc.
- Seah Sun Too
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void reduction in indium thermal interface material
- Patent number 7,651,938
- Issue date Jan 26, 2010
- Advanced Micro Devices, Inc.
- Seah Sun Too
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided waffle pack
- Patent number 7,482,697
- Issue date Jan 27, 2009
- Advanced Micro Devices, Inc.
- Soon Tatt Ow Yong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Void Reduction in Indium Thermal Interface Material
- Publication number 20100117222
- Publication date May 13, 2010
- Seah Sun Too
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double-Sided Waffle Pack
- Publication number 20080029904
- Publication date Feb 7, 2008
- Soon Tatt Ow Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Void Reduction in Indium Thermal Interface Material
- Publication number 20070284737
- Publication date Dec 13, 2007
- Seah Sun Too
- H01 - BASIC ELECTRIC ELEMENTS