Hsiao-Chung Liang

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure
- Patent number 11,749,582
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,444,002
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming bonding structures
- Patent number 11,233,032
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for controlling warpage in packaging
- Patent number 10,985,135
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a boundary structure, a package on pack...
- Patent number 10,804,234
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for controlling warpage in packaging
- Patent number 10,510,712
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming bonding structures
- Patent number 10,504,870
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Video camera, setting method and adjusting method thereof
- Patent number 10,313,598
- Issue date Jun 4, 2019
- Lite-On Electronics (Guangzhou) Limited
- Hsiao-Lung Liang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device having a boundary structure, a package on pack...
- Patent number 10,276,531
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for controlling warpage in packaging
- Patent number 10,157,881
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming bonding structures
- Patent number 9,768,142
- Issue date Sep 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a boundary structure, a package on pack...
- Patent number 9,659,891
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for controlling warpage in packaging
- Patent number 9,484,226
- Issue date Nov 1, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for controlling warpage in packaging
- Patent number 9,093,337
- Issue date Jul 28, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and grounding device for enhancing EMS and wireless communic...
- Patent number 8,786,513
- Issue date Jul 22, 2014
- Climax Technology Co., Ltd.
- Hsiao-Pin Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless security device
- Patent number 8,780,005
- Issue date Jul 15, 2014
- Climax Technology Co., Ltd.
- Cheng-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20220359343
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20220037228
- Publication date Feb 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIDEO CAMERA
- Publication number 20200349818
- Publication date Nov 5, 2020
- Robert Bosch Smart Home GmbH
- Chia-Hung CHOU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Methods for Controlling Warpage in Packaging
- Publication number 20200118969
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mechanisms for Forming Bonding Structures
- Publication number 20200105710
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A BOUNDARY STRUCTURE, A PACKAGE ON PACK...
- Publication number 20190237422
- Publication date Aug 1, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Controlling Warpage in Packaging
- Publication number 20190123018
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIDEO CAMERA, SETTING METHOD AND ADJUSTING METHOD THEREOF
- Publication number 20180084200
- Publication date Mar 22, 2018
- LITE-ON ELECTRONICS (GUANGZHOU) LIMITED
- Hsiao-Lung Liang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Mechanisms For Forming Bonding Structures
- Publication number 20180005976
- Publication date Jan 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A BOUNDARY STRUCTURE, A PACKAGE ON PACK...
- Publication number 20170256513
- Publication date Sep 7, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Controlling Warpage in Packaging
- Publication number 20170032980
- Publication date Feb 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Controlling Warpage in Packaging
- Publication number 20150262845
- Publication date Sep 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF MODULE AND WIRELESS COMMUNICATION DEVICE
- Publication number 20150200698
- Publication date Jul 16, 2015
- Climax Technology Co., Ltd.
- Hsiao-Pin LIANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Methods for Controlling Warpage in Packaging
- Publication number 20150093858
- Publication date Apr 2, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A BOUNDARY STRUCTURE, A PACKAGE ON PACK...
- Publication number 20150069604
- Publication date Mar 12, 2015
- TAIWAN SEMICODUCTOR MANUFACTURING COMPANY, LTD.
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR FORMING BONDING STRUCTURES
- Publication number 20150021760
- Publication date Jan 22, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Yeong-Jyh LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS SECURITY DEVICE
- Publication number 20130257671
- Publication date Oct 3, 2013
- CLIMAX TECHNOLOGY CO., LTD
- Cheng-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND GROUNDING DEVICE FOR ENHANCING EMS AND WIRELESS COMMUNIC...
- Publication number 20130169487
- Publication date Jul 4, 2013
- CLIMAX TECHNOLOGY CO., LTD
- Hsiao-Pin LIANG
- H01 - BASIC ELECTRIC ELEMENTS

Hsiao-Chung Liang

Person

Patents Grantslast 30 patents

Package structure

Package structure

Mechanisms for forming bonding structures

Methods for controlling warpage in packaging

Semiconductor device having a boundary structure, a package on pack...

Methods for controlling warpage in packaging

Mechanisms for forming bonding structures

Video camera, setting method and adjusting method thereof

Semiconductor device having a boundary structure, a package on pack...

Methods for controlling warpage in packaging

Mechanisms for forming bonding structures

Semiconductor device having a boundary structure, a package on pack...

Methods for controlling warpage in packaging

Methods for controlling warpage in packaging

Device and grounding device for enhancing EMS and wireless communic...

Wireless security device

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

PACKAGE STRUCTURE

VIDEO CAMERA

Methods for Controlling Warpage in Packaging

Mechanisms for Forming Bonding Structures

SEMICONDUCTOR DEVICE HAVING A BOUNDARY STRUCTURE, A PACKAGE ON PACK...

Methods for Controlling Warpage in Packaging

VIDEO CAMERA, SETTING METHOD AND ADJUSTING METHOD THEREOF

Mechanisms For Forming Bonding Structures

SEMICONDUCTOR DEVICE HAVING A BOUNDARY STRUCTURE, A PACKAGE ON PACK...

Methods for Controlling Warpage in Packaging

Methods for Controlling Warpage in Packaging

RF MODULE AND WIRELESS COMMUNICATION DEVICE

Methods for Controlling Warpage in Packaging

SEMICONDUCTOR DEVICE HAVING A BOUNDARY STRUCTURE, A PACKAGE ON PACK...

MECHANISMS FOR FORMING BONDING STRUCTURES

WIRELESS SECURITY DEVICE

DEVICE AND GROUNDING DEVICE FOR ENHANCING EMS AND WIRELESS COMMUNIC...