Hsiao-Hua Peng

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Heating platform, thermal treatment and manufacturing method
- Patent number 12,142,497
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Hua Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating platform, thermal treatment and manufacturing method
- Patent number 11,107,708
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Hua Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for controlling wafer uniformity
- Patent number 11,062,886
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao-Hua Peng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEATING PLATFORM, THERMAL TREATMENT AND MANUFACTURING METHOD
- Publication number 20240387203
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Hua Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATING PLATFORM, THERMAL TREATMENT AND MANUFACTURING METHOD
- Publication number 20210327730
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Hua Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR CONTROLLING WAFER UNIFORMITY
- Publication number 20210296100
- Publication date Sep 23, 2021
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Hsiao-Hua Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR IN-LINE PROCESSING CONTROL
- Publication number 20190164852
- Publication date May 30, 2019
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Hsiao-Hua PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR CONTROLLING WAFER UNIFORMITY
- Publication number 20190164730
- Publication date May 30, 2019
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Hsiao-Hua Peng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HEATING PLATFORM, THERMAL TREATMENT AND MANUFACTURING METHOD
- Publication number 20190148185
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao-Hua Peng
- H01 - BASIC ELECTRIC ELEMENTS

Hsiao-Hua Peng

Person

Patents Grantslast 30 patents

Heating platform, thermal treatment and manufacturing method

Heating platform, thermal treatment and manufacturing method

Apparatus and method for controlling wafer uniformity

Patents Applicationslast 30 patents

HEATING PLATFORM, THERMAL TREATMENT AND MANUFACTURING METHOD

HEATING PLATFORM, THERMAL TREATMENT AND MANUFACTURING METHOD

APPARATUS AND METHOD FOR CONTROLLING WAFER UNIFORMITY

SYSTEM AND METHOD FOR IN-LINE PROCESSING CONTROL

APPARATUS AND METHOD FOR CONTROLLING WAFER UNIFORMITY

HEATING PLATFORM, THERMAL TREATMENT AND MANUFACTURING METHOD