TREA

Hsiao-Jen Hung

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  • Taichung, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Package structure
    • Patent number 8,873,244
    • Issue date Oct 28, 2014
    • Siliconware Precision Industries Co., Ltd.
    • Pang-Chun Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Package structure fabrication method
    • Patent number 7,934,313
    • Issue date May 3, 2011
    • Siliconware Precision Industries Co., Ltd.
    • Pang-Chun Lin
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20110157851
    • Publication date Jun 30, 2011
    • Siliconware Precision Industries Co., Ltd.
    • Pang-Chun Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor package and method for fabricating the same
    • Publication number 20080303134
    • Publication date Dec 11, 2008
    • Siliconware Precision Industries Co., Ltd.
    • Chun-Yuan Li
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...