Hsiao Jung LIN

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Taichung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board with stacked passive components
- Patent number 12,022,618
- Issue date Jun 25, 2024
- Western Digital Technologies, Inc.
- Chien Te Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bumped pad structure
- Patent number 11,557,555
- Issue date Jan 17, 2023
- Western Digital Technologies, Inc.
- Hsiao Jung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD WITH STACKED PASSIVE COMPONENTS
- Publication number 20220346234
- Publication date Oct 27, 2022
- Western Digital Technologies, Inc.
- Chien Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPED PAD STRUCTURE
- Publication number 20210391286
- Publication date Dec 16, 2021
- Western Digital Technologies, Inc.
- Hsiao Jung LIN
- H01 - BASIC ELECTRIC ELEMENTS