Hsiao-Lan YEH

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Tainan City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Wafer coating system and method of manufacturing chip package
- Patent number 10,388,541
- Issue date Aug 20, 2019
- Xintec Inc.
- Yu-Tung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,947,716
- Issue date Apr 17, 2018
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,875,912
- Issue date Jan 23, 2018
- Xintec Inc.
- Yen-Shih Ho
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230369151
- Publication date Nov 16, 2023
- XINTEC INC.
- Hsiao-Lan YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170148844
- Publication date May 25, 2017
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170148694
- Publication date May 25, 2017
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170012081
- Publication date Jan 12, 2017
- XINTEC INC.
- Chia-Lun SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER COATING SYSTEM AND METHOD OF MANUFACTURING CHIP PACKAGE
- Publication number 20160307779
- Publication date Oct 20, 2016
- XINTEC INC.
- Yu-Tung CHEN
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...