Hsiao-Yen LEE

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structures and methods of manufacturing the same
- Patent number 11,806,710
- Issue date Nov 7, 2023
- Advanced Semiconductor Engineering, Inc.
- Hsiao-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210379590
- Publication date Dec 9, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsiao-Yen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER, SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTU...
- Publication number 20180122749
- Publication date May 3, 2018
- Advanced Semiconductor Engineering, Inc.
- Ying-Chih LEE
- H01 - BASIC ELECTRIC ELEMENTS