HsiaoYun Lo

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming semiconductor device having backside interconnect...
- Patent number 11,823,979
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having backside interconnect structure on thro...
- Patent number 11,056,419
- Issue date Jul 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having backside interconnect structure on thro...
- Patent number 10,510,641
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-stacking apparatus having a transport device configured to tra...
- Patent number 9,842,823
- Issue date Dec 12, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having backside interconnect structure through...
- Patent number 9,449,898
- Issue date Sep 20, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Having Backside Interconnect Structure on Thr...
- Publication number 20230386976
- Publication date Nov 30, 2023
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Semiconductor Device Having Backside Interconnect...
- Publication number 20210335694
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Backside Interconnect Structure on Thro...
- Publication number 20200006201
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Backside Interconnect Structure on Thro...
- Publication number 20170011988
- Publication date Jan 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-STACKING APPARATUS
- Publication number 20160190087
- Publication date Jun 30, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING BACKSIDE INTERCONNECT STRUCTURE ON THRO...
- Publication number 20150035159
- Publication date Feb 5, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS

HsiaoYun Lo

Person

Patents Grantslast 30 patents

Method of forming semiconductor device having backside interconnect...

Semiconductor device having backside interconnect structure on thro...

Semiconductor device having backside interconnect structure on thro...

Chip-stacking apparatus having a transport device configured to tra...

Semiconductor device having backside interconnect structure through...

Patents Applicationslast 30 patents

Semiconductor Device Having Backside Interconnect Structure on Thr...

Method of Forming Semiconductor Device Having Backside Interconnect...

Semiconductor Device Having Backside Interconnect Structure on Thro...

Semiconductor Device Having Backside Interconnect Structure on Thro...

CHIP-STACKING APPARATUS

SEMICONDUCTOR DEVICE HAVING BACKSIDE INTERCONNECT STRUCTURE ON THRO...