Hsichang Liu

Person

Fishkill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Additives for grain fragmentation in Pb-free Sn-based solder
- Patent number 8,910,853
- Issue date Dec 16, 2014
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Additives for grain fragmentation in Pb-free Sn-based solder
- Patent number 8,493,746
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reliability enhancement of metal thermal interface
- Patent number 8,232,636
- Issue date Jul 31, 2012
- International Business Machines Corporation
- James N Humenik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for providing uniaxial load distribution for laminate lay...
- Patent number 8,156,990
- Issue date Apr 17, 2012
- International Business Machines Corporation
- Jay A. Bunt
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for providing uniaxial load distribution for laminate layers...
- Patent number 7,947,143
- Issue date May 24, 2011
- International Business Machines Corporation
- Jay A. Bunt
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus for providing uniaxial load distribution for laminate lay...
- Patent number 7,836,935
- Issue date Nov 23, 2010
- International Business Machines Corporation
- Jay A. Bunt
- B32 - LAYERED PRODUCTS
Information Patent Grant
Intermetallic diffusion block device and method of manufacture
- Patent number 7,683,493
- Issue date Mar 23, 2010
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nickel alloy plated structure
- Patent number 7,472,650
- Issue date Jan 6, 2009
- International Business Machines Corporation
- Harry David Cox
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatuses for dissipating heat from semiconductor devices
- Patent number 7,369,410
- Issue date May 6, 2008
- International Business Machines Corporation
- Howard Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Micro-bumps to enhance LGA interconnections
- Patent number 7,302,757
- Issue date Dec 4, 2007
- International Business Machines Corporation
- Jeffrey A. Brody
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nickel alloy plated structure
- Patent number 7,287,468
- Issue date Oct 30, 2007
- International Business Machines Corporation
- Harry David Cox
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Partial wafer bonding and dicing
- Patent number 7,078,320
- Issue date Jul 18, 2006
- International Business Machines Corporation
- Louis C. Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rework method for finishing metallurgy on chip carriers
- Patent number 6,838,009
- Issue date Jan 4, 2005
- International Business Machines Corporation
- Charles L. Arvin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Screening mask having a stress-relieving area
- Patent number 6,662,718
- Issue date Dec 16, 2003
- International Business Machines Corporation
- Evelyn Barrington
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of forming conductive line features for enhanced reliability...
- Patent number 6,348,233
- Issue date Feb 19, 2002
- International Business Machines Corporation
- Jeffrey A. Brody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive line features for enhanced reliability of multi-layer ce...
- Patent number 6,217,989
- Issue date Apr 17, 2001
- International Business Machines Corporation
- Jeffrey A. Brody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of performing processes on features with electricity
- Patent number 5,985,128
- Issue date Nov 16, 1999
- International Business Machines Corporation
- Shaji Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of performing processes on features with electricity
- Patent number 5,935,404
- Issue date Aug 10, 1999
- International Business Machines Corporation
- Shaji Farooq
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER
- Publication number 20130284495
- Publication date Oct 31, 2013
- Charles L. Arvin
- B82 - NANO-TECHNOLOGY
Information Patent Application
RELIABILITY ENHANCEMENT OF METAL THERMAL INTERFACE
- Publication number 20110180923
- Publication date Jul 28, 2011
- International Business Machines Corporation
- JAMES N. HUMENIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER
- Publication number 20100200271
- Publication date Aug 12, 2010
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERMETALLIC DIFFUSION BLOCK DEVICE AND METHOD OF MANUFACTURE
- Publication number 20090267228
- Publication date Oct 29, 2009
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR LAMINATE LAYERS...
- Publication number 20080190545
- Publication date Aug 14, 2008
- International Business Machines Corporation
- Jay A. Bunt
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR LAMINATE LAY...
- Publication number 20080190565
- Publication date Aug 14, 2008
- International Business Machines Corporation
- Jay A. Bunt
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR LAMINATE LAY...
- Publication number 20080190566
- Publication date Aug 14, 2008
- International Business Machines Corporation
- Jay A. Bunt
- B32 - LAYERED PRODUCTS
Information Patent Application
Apparatuses for Dissipating Heat from Semiconductor Devices
- Publication number 20080170368
- Publication date Jul 17, 2008
- International Business Machines Corporation
- Howard Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
NICKEL ALLOY PLATED STRUCTURE
- Publication number 20080070057
- Publication date Mar 20, 2008
- Harry David Cox
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatuses for dissipating heat from semiconductor devices
- Publication number 20070258213
- Publication date Nov 8, 2007
- International Business Machines Corporation
- Howard Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHOD AND APPARATUS FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR L...
- Publication number 20070113950
- Publication date May 24, 2007
- International Business Machines Corporation
- Jay A. Bunt
- B32 - LAYERED PRODUCTS
Information Patent Application
NICKEL ALLOY PLATED STRUCTURE
- Publication number 20060269770
- Publication date Nov 30, 2006
- International Business Machines Corporation
- Harry David Cox
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITE ELECTROFORMED SCREENING MASK AND METHOD OF MAKING THE SAME
- Publication number 20060243700
- Publication date Nov 2, 2006
- International Business Machines Corporation
- Robert P. Rippstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ON-CHIP COOLING
- Publication number 20060145356
- Publication date Jul 6, 2006
- International Business Machines Corporation
- Hsichang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTIAL WAFER BONDING AND DICING
- Publication number 20060035443
- Publication date Feb 16, 2006
- International Business Machines Corporation
- Louis C. Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro-bumps to enhance LGA interconnections
- Publication number 20060030170
- Publication date Feb 9, 2006
- Jeffrey A. Brody
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-BUMPS TO ENHANCE LGA INTERCONNECTIONS
- Publication number 20050221635
- Publication date Oct 6, 2005
- International Business Machines Corporation
- Jeffrey A. Brody
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Rework method for finishing metallurgy on chip carriers
- Publication number 20030080092
- Publication date May 1, 2003
- International Business Machines Corporation
- Charles L. Arvin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Screening mask having a stress-relieving area
- Publication number 20030004076
- Publication date Jan 2, 2003
- International Business Machines Corporation
- Evelyn Barrington
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method of forming conductive line features for enhanced reliability...
- Publication number 20010051210
- Publication date Dec 13, 2001
- Jeffrey A. Brody
- H01 - BASIC ELECTRIC ELEMENTS

Hsichang Liu

Person

Patents Grantslast 30 patents

Additives for grain fragmentation in Pb-free Sn-based solder

Additives for grain fragmentation in Pb-free Sn-based solder

Reliability enhancement of metal thermal interface

Apparatus for providing uniaxial load distribution for laminate lay...

Method for providing uniaxial load distribution for laminate layers...

Apparatus for providing uniaxial load distribution for laminate lay...

Intermetallic diffusion block device and method of manufacture

Nickel alloy plated structure

Apparatuses for dissipating heat from semiconductor devices

Micro-bumps to enhance LGA interconnections

Nickel alloy plated structure

Partial wafer bonding and dicing

Rework method for finishing metallurgy on chip carriers

Screening mask having a stress-relieving area

Method of forming conductive line features for enhanced reliability...

Conductive line features for enhanced reliability of multi-layer ce...

Method of performing processes on features with electricity

Method of performing processes on features with electricity

Patents Applicationslast 30 patents

ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER

RELIABILITY ENHANCEMENT OF METAL THERMAL INTERFACE

ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER

INTERMETALLIC DIFFUSION BLOCK DEVICE AND METHOD OF MANUFACTURE

METHOD FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR LAMINATE LAYERS...

APPARATUS FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR LAMINATE LAY...

APPARATUS FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR LAMINATE LAY...

Apparatuses for Dissipating Heat from Semiconductor Devices

NICKEL ALLOY PLATED STRUCTURE

Apparatuses for dissipating heat from semiconductor devices

METHOD AND APPARATUS FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR L...

NICKEL ALLOY PLATED STRUCTURE

COMPOSITE ELECTROFORMED SCREENING MASK AND METHOD OF MAKING THE SAME

ON-CHIP COOLING

PARTIAL WAFER BONDING AND DICING

Micro-bumps to enhance LGA interconnections

MICRO-BUMPS TO ENHANCE LGA INTERCONNECTIONS

Rework method for finishing metallurgy on chip carriers

Screening mask having a stress-relieving area

Method of forming conductive line features for enhanced reliability...