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Hsieh Ting Kuek
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Melaka, MY
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor package with air cavity
Patent number
10,777,536
Issue date
Sep 15, 2020
Infineon Technologies AG
Chau Fatt Chiang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Functionalized interface structure
Patent number
9,922,910
Issue date
Mar 20, 2018
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a semiconductor package using a carrier
Patent number
7,977,161
Issue date
Jul 12, 2011
Infineon Technologies AG
Chau Fatt Chiang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Package with Air Cavity
Publication number
20190181120
Publication date
Jun 13, 2019
INFINEON TECHNOLOGIES AG
Chau Fatt Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Functionalized interface structure
Publication number
20170098598
Publication date
Apr 6, 2017
Infineon Technologies Austria AG
Ralf OTREMBA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Devices with Increased Creepage Distances
Publication number
20160365296
Publication date
Dec 15, 2016
INFINEON TECHNOLOGIES AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of manufacturing a semiconductor package using a carrier
Publication number
20100124802
Publication date
May 20, 2010
Chau Fatt Chiang
H01 - BASIC ELECTRIC ELEMENTS