Hsien-Chieh HSIAO

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 12,033,868
- Issue date Jul 9, 2024
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 11,728,178
- Issue date Aug 15, 2023
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier structure and package structure
- Patent number 11,239,125
- Issue date Feb 1, 2022
- Siliconware Precision Industries Co., Ltd.
- Hsien-Lung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 10,903,088
- Issue date Jan 26, 2021
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process kit of physical vapor deposition chamber and fabricating me...
- Patent number 9,803,274
- Issue date Oct 31, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wei Bih
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20240321591
- Publication date Sep 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230343603
- Publication date Oct 26, 2023
- Siliconware Precision Industries CO, Ltd
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20210143021
- Publication date May 13, 2021
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE AND PACKAGE STRUCTURE
- Publication number 20200035573
- Publication date Jan 30, 2020
- Siliconware Precision Industries Co., Ltd.
- Hsien-Lung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20180286701
- Publication date Oct 4, 2018
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS KIT OF PHYSICAL VAPOR DEPOSITION CHAMBER AND FABRICATING ME...
- Publication number 20150129414
- Publication date May 14, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei BIH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Hsien-Chieh HSIAO

Person

Patents Grantslast 30 patents

Electronic package and method for fabricating the same

Method for fabricating electronic package

Carrier structure and package structure

Electronic package and method for fabricating the same

Process kit of physical vapor deposition chamber and fabricating me...

Patents Applicationslast 30 patents

METHOD FOR FABRICATING ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

METHOD FOR FABRICATING ELECTRONIC PACKAGE

CARRIER STRUCTURE AND PACKAGE STRUCTURE

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

PROCESS KIT OF PHYSICAL VAPOR DEPOSITION CHAMBER AND FABRICATING ME...