Hsien-Lung Yang

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Campbell, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Sputter deposition and etching of metallization seed layer for over...
- Patent number 7,294,574
- Issue date Nov 13, 2007
- Applied Materials, Inc.
- Peijun Ding
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Sputter deposition and etching of metallization seed layer for over...
- Publication number 20060030151
- Publication date Feb 9, 2006
- APPLIED MATERIALS, INC.
- Peijun Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compensation of spacing between magnetron and sputter target
- Publication number 20050133361
- Publication date Jun 23, 2005
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...