HSIEN-MING TU

Person

HSINCHU COUNTY, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 11,923,318
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
- Patent number 11,837,562
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-mode wireless charging device
- Patent number 11,735,518
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,469,200
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 11,107,772
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump structure and fabricating method thereof
- Patent number 10,985,121
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with solder regions aligned to recesses
- Patent number 10,879,198
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,854,564
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hollow metal pillar packaging scheme
- Patent number 10,825,804
- Issue date Nov 3, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-mode wireless charging device
- Patent number 10,497,646
- Issue date Dec 3, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei Liang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Hollow metal pillar packaging scheme
- Patent number 10,354,986
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure
- Patent number 10,269,737
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with solder regions aligned to recesses
- Patent number 10,262,958
- Issue date Apr 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabricating method thereof
- Patent number 10,163,828
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicondcutor structure and semiconductor manufacturing process the...
- Patent number 10,062,654
- Issue date Aug 28, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,032,737
- Issue date Jul 24, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensing system and associated electronic device
- Patent number 9,943,239
- Issue date Apr 17, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hung-Yi Kuo
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Package with solder regions aligned to recesses
- Patent number 9,947,630
- Issue date Apr 17, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive terminal on integrated circuit
- Patent number 9,852,985
- Issue date Dec 26, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hollow metal pillar packaging scheme
- Patent number 9,812,434
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures having height-adjusted molding members and metho...
- Patent number 9,799,615
- Issue date Oct 24, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,786,618
- Issue date Oct 10, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shadow pad for post-passivation interconnect structures
- Patent number 9,748,212
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hollow metal pillar packaging scheme
- Patent number 9,679,883
- Issue date Jun 13, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out (InFO) package structures and methods of forming...
- Patent number 9,640,498
- Issue date May 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and seal ring structure
- Patent number 9,627,332
- Issue date Apr 18, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with solder regions aligned to recesses
- Patent number 9,559,044
- Issue date Jan 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,484,318
- Issue date Nov 1, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM capacitor and method forming the same
- Patent number 9,461,106
- Issue date Oct 4, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hollow metal pillar packaging scheme
- Patent number 9,343,417
- Issue date May 17, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240170414
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Hsien Chiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BUMP OF A SEMICONDUCTOR DEVICE AND FABRICATING METHOD TH...
- Publication number 20240055377
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHANG-PIN HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-MODE WIRELESS CHARGING DEVICE
- Publication number 20230387003
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih-Wei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20210391276
- Publication date Dec 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Hsien Chiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
- Publication number 20210225788
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHANG-PIN HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210082849
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- TUNG-LIANG SHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20200273806
- Publication date Aug 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Hsien Chiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL-MODE WIRELESS CHARGING DEVICE
- Publication number 20200066635
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih-Wei LIANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Hollow Metal Pillar Packaging Scheme
- Publication number 20190341377
- Publication date Nov 7, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Solder Regions Aligned to Recesses
- Publication number 20190214356
- Publication date Jul 11, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
- Publication number 20190115312
- Publication date Apr 18, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- CHANG-PIN HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180331059
- Publication date Nov 15, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- TUNG-LIANG SHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Solder Regions Aligned to Recesses
- Publication number 20180226370
- Publication date Aug 9, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hollow Metal Pillar Packaging Scheme
- Publication number 20180040599
- Publication date Feb 8, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20180033750
- Publication date Feb 1, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- CHANG-PIN HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-MODE WIRELESS CHARGING DEVICE
- Publication number 20180033725
- Publication date Feb 1, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih-Wei LIANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDCUTOR STRUCTURE AND SEMICONDUCTOR MANUFACTURING PROCESS THE...
- Publication number 20180025997
- Publication date Jan 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE TERMINAL ON INTEGRATED CIRCUIT
- Publication number 20170372999
- Publication date Dec 28, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hollow Metal Pillar Packaging Scheme
- Publication number 20170271316
- Publication date Sep 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSING SYSTEM AND ASSOCIATED ELECTRONIC DEVICE
- Publication number 20170251937
- Publication date Sep 7, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- HUNG-YI KUO
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170141056
- Publication date May 18, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- CHANG-PIN HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Solder Regions Aligned to Recesses
- Publication number 20170141054
- Publication date May 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT (INFO) PACKAGE STRUCTURES AND METHODS OF FORMING...
- Publication number 20170110425
- Publication date Apr 20, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20160372434
- Publication date Dec 22, 2016
- TUNG-LIANG SHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures, Packaged Semiconductor Devices, and Method...
- Publication number 20160322337
- Publication date Nov 3, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM Capacitor and Method Forming the Same
- Publication number 20160276426
- Publication date Sep 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hollow Metal Pillar Packaging Scheme
- Publication number 20160225751
- Publication date Aug 4, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20150235977
- Publication date Aug 20, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- TUNG-LIANG SHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNMENT STRUCTURE FOR WAFER LEVEL CHIP SCALE PACKAGE
- Publication number 20150228599
- Publication date Aug 13, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
- Publication number 20150137350
- Publication date May 21, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- CHANG-PIN HUANG
- H01 - BASIC ELECTRIC ELEMENTS

HSIEN-MING TU

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor package

Conductive bump of a semiconductor device and fabricating method th...

Dual-mode wireless charging device

Semiconductor device and manufacturing method thereof

Semiconductor package and method of manufacturing semiconductor pac...

Bump structure and fabricating method thereof

Package with solder regions aligned to recesses

Semiconductor device and manufacturing method thereof

Hollow metal pillar packaging scheme

Dual-mode wireless charging device

Hollow metal pillar packaging scheme

Method for manufacturing semiconductor structure

Package with solder regions aligned to recesses

Semiconductor device and fabricating method thereof

Semicondcutor structure and semiconductor manufacturing process the...

Semiconductor device and manufacturing method thereof

Optical sensing system and associated electronic device

Package with solder regions aligned to recesses

Conductive terminal on integrated circuit

Hollow metal pillar packaging scheme

Package structures having height-adjusted molding members and metho...

Semiconductor structure and manufacturing method thereof

Shadow pad for post-passivation interconnect structures

Hollow metal pillar packaging scheme

Integrated fan-out (InFO) package structures and methods of forming...

Integrated circuit structure and seal ring structure

Package with solder regions aligned to recesses

Semiconductor device and manufacturing method thereof

MIM capacitor and method forming the same

Hollow metal pillar packaging scheme

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

CONDUCTIVE BUMP OF A SEMICONDUCTOR DEVICE AND FABRICATING METHOD TH...

DUAL-MODE WIRELESS CHARGING DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

DUAL-MODE WIRELESS CHARGING DEVICE

Hollow Metal Pillar Packaging Scheme

Package with Solder Regions Aligned to Recesses

SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Package with Solder Regions Aligned to Recesses

Hollow Metal Pillar Packaging Scheme

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

DUAL-MODE WIRELESS CHARGING DEVICE

SEMICONDCUTOR STRUCTURE AND SEMICONDUCTOR MANUFACTURING PROCESS THE...

CONDUCTIVE TERMINAL ON INTEGRATED CIRCUIT

Hollow Metal Pillar Packaging Scheme

OPTICAL SENSING SYSTEM AND ASSOCIATED ELECTRONIC DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Package with Solder Regions Aligned to Recesses

INTEGRATED FAN-OUT (INFO) PACKAGE STRUCTURES AND METHODS OF FORMING...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Interconnect Structures, Packaged Semiconductor Devices, and Method...

MIM Capacitor and Method Forming the Same

Hollow Metal Pillar Packaging Scheme

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SELF-ALIGNMENT STRUCTURE FOR WAFER LEVEL CHIP SCALE PACKAGE

SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF