Hsien-Pin Tsou

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Shift control method in manufacture of semiconductor device
- Patent number 12,148,733
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,855,003
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon interposer including through-silicon via structures with en...
- Patent number 11,456,245
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Ju Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon interposer including through-silicon via structures with en...
- Patent number 11,296,032
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Ju Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,205,615
- Issue date Dec 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Ju Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shift control method in manufacture of semiconductor device
- Patent number 11,183,482
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with a heat dissipating element and method of man...
- Patent number 11,164,855
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,139,285
- Issue date Oct 5, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Ju Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package of integrated circuits having a light-to-heat-conversion co...
- Patent number 10,916,450
- Issue date Feb 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Ju Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,879,194
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 10,586,763
- Issue date Mar 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Ju Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PoP device and method of forming the same
- Patent number 10,510,732
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Ju Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, method for forming semiconductor package, an...
- Patent number 10,497,690
- Issue date Dec 3, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Ju Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a release film as isolation film in package
- Patent number 10,269,589
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Ju Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ornamental plate mounting structure
- Patent number 6,976,868
- Issue date Dec 20, 2005
- Tatung Co., Ltd.
- Ming-Chun Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-function control key structure
- Patent number 6,844,511
- Issue date Jan 18, 2005
- Tatung Co., Ltd.
- Ming-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE
- Publication number 20240379617
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Sigulating Semiconductor Devices and Package Device Incl...
- Publication number 20240222292
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Ju Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF THE SEMICONDUCTOR PACKAGE, PICK AND PLACE D...
- Publication number 20240178015
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240071849
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-You Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON INTERPOSER INCLUDING THROUGH-SILICON VIA STRUCTURES WITH EN...
- Publication number 20230020959
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Ju TSOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220367383
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE
- Publication number 20220077108
- Publication date Mar 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON INTERPOSER INCLUDING THROUGH-SILICON VIA STRUCTURES WITH EN...
- Publication number 20210375741
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Ju TSOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON INTERPOSER INCLUDING THROUGH-SILICON VIA STRUCTURES WITH EN...
- Publication number 20210375768
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Ju TSOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE
- Publication number 20210082870
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210082894
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200091131
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIEN-JU TSOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20200006225
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Ju Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20190148288
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Ju Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POP DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20190103387
- Publication date Apr 4, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Ju Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD FOR FORMING SEMICONDUCTOR PACKAGE, AN...
- Publication number 20190096868
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIEN-JU TSOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Release Film as Isolation Film in Package
- Publication number 20190096700
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Ju Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Release Film as Isolation Film in Package
- Publication number 20190006199
- Publication date Jan 3, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Ju Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180342466
- Publication date Nov 29, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ornamental plate mounting structure
- Publication number 20050186836
- Publication date Aug 25, 2005
- Tatung Co., Ltd.
- Ming-Chun Hsu
- G06 - COMPUTING CALCULATING COUNTING

Hsien-Pin Tsou

Person

Patents Grantslast 30 patents

Shift control method in manufacture of semiconductor device

Package structure and method of fabricating the same

Silicon interposer including through-silicon via structures with en...

Silicon interposer including through-silicon via structures with en...

Semiconductor device and method of manufacture

Shift control method in manufacture of semiconductor device

Package structure with a heat dissipating element and method of man...

Semiconductor package

Package of integrated circuits having a light-to-heat-conversion co...

Semiconductor device package and method of manufacturing the same

Semiconductor device and method of manufacture

PoP device and method of forming the same

Semiconductor package, method for forming semiconductor package, an...

Method of manufacturing a release film as isolation film in package

Ornamental plate mounting structure

Multi-function control key structure

Patents Applicationslast 30 patents

SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE

Method for Sigulating Semiconductor Devices and Package Device Incl...

MANUFACTURING METHOD OF THE SEMICONDUCTOR PACKAGE, PICK AND PLACE D...

SEMICONDUCTOR PACKAGE AND METHOD

SILICON INTERPOSER INCLUDING THROUGH-SILICON VIA STRUCTURES WITH EN...

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE

SILICON INTERPOSER INCLUDING THROUGH-SILICON VIA STRUCTURES WITH EN...

SILICON INTERPOSER INCLUDING THROUGH-SILICON VIA STRUCTURES WITH EN...

SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

Semiconductor Device and Method of Manufacture

Semiconductor Device and Method of Manufacture

POP DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE, METHOD FOR FORMING SEMICONDUCTOR PACKAGE, AN...

Method of Manufacturing a Release Film as Isolation Film in Package

Release Film as Isolation Film in Package

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Ornamental plate mounting structure