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Hsien-Ping Feng

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  • Watertown, WA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Metal deposition using seed layers
    • Patent number 8,580,100
    • Issue date Nov 12, 2013
    • Massachusetts Institute of Technology
    • Hsien-Ping Feng
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Metal deposition using seed layers
    • Publication number 20120217165
    • Publication date Aug 30, 2012
    • Massachusetts Institute of Technology
    • Hsien-Ping Feng
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR