Hsien-Wen HSU

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method and a related stackable chip package
- Patent number 11,024,603
- Issue date Jun 1, 2021
- Powertech Technology Inc.
- Ming-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked package structure with encapsulation and redistribution lay...
- Patent number 10,892,250
- Issue date Jan 12, 2021
- Powertech Technology Inc.
- Ming-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked package including exterior conductive element and a manufac...
- Patent number 10,354,978
- Issue date Jul 16, 2019
- POWERTECH TECHNOLOGY INC.
- Ming-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package process method including disposing a die within a recess of...
- Patent number 10,224,254
- Issue date Mar 5, 2019
- Powertech Technology Inc.
- Ming-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier substrate
- Patent number 9,659,884
- Issue date May 23, 2017
- Powertech Technology Inc.
- Yuan-Fu Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for detecting lock error in sensorless motor
- Patent number 8,310,190
- Issue date Nov 13, 2012
- inergy Technology Inc.
- Hsien-Wen Hsu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
System and method for controlling sensorless motor
- Patent number 8,269,444
- Issue date Sep 18, 2012
- inergy Technology Inc.
- Chien-Chung Tseng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Apparatus and method for driving sensorless motor
- Patent number 8,188,700
- Issue date May 29, 2012
- inergy Technology Inc.
- Chien-Chung Tseng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
High-side driver
- Patent number 7,746,148
- Issue date Jun 29, 2010
- inergy Technology Inc.
- Hsien-Wen Hsu
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
STACKED PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20200203313
- Publication date Jun 25, 2020
- Powertech Technology Inc.
- Ming-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Mode Selection Electronically Commuted Motor
- Publication number 20200144907
- Publication date May 7, 2020
- INERGY TECHNOLOGY INC.
- Chorng-Wei Liaw
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190252325
- Publication date Aug 15, 2019
- Powertech Technology Inc.
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD AND A RELATED STACKABLE CHIP PACKAGE
- Publication number 20190244934
- Publication date Aug 8, 2019
- Powertech Technology Inc.
- Ming-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE INCLUDING EXTERIOR CONDUCTIVE ELEMENT AND A MANUFAC...
- Publication number 20190214366
- Publication date Jul 11, 2019
- Powertech Technology Inc.
- Ming-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE AND A MANUFACTURING METHOD OF THE SAME
- Publication number 20190214367
- Publication date Jul 11, 2019
- Powertech Technology Inc.
- Ming-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE PROCESS METHOD INCLUDING DISPOSING A DIE WITHIN A RECESS OF...
- Publication number 20180315674
- Publication date Nov 1, 2018
- Powertech Technology Inc.
- Ming-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE
- Publication number 20180114782
- Publication date Apr 26, 2018
- Powertech Technology Inc.
- Chi-An Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20170047277
- Publication date Feb 16, 2017
- Powertech Technology Inc.
- Yuan-Fu Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE
- Publication number 20170047295
- Publication date Feb 16, 2017
- Powertech Technology Inc.
- Yuan-Fu Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR CONTROLLING SENSORLESS MOTOR
- Publication number 20110241588
- Publication date Oct 6, 2011
- INERGY TECHNOLOGY INC.
- Chien-Chung TSENG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
APPARATUS AND METHOD FOR DETECTING LOCK ERROR IN SENSORLESS MOTOR
- Publication number 20110074322
- Publication date Mar 31, 2011
- INERGY TECHNOLOGY INC.
- Hsien-Wen HSU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
APPARATUS AND METHOD FOR DRIVING SENSORLESS MOTOR
- Publication number 20110062907
- Publication date Mar 17, 2011
- INERGY TECHNOLOGY INC.
- Chien-Chung TSENG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
HIGH-SIDE DRIVER
- Publication number 20090256619
- Publication date Oct 15, 2009
- INERGY TECHNOLOGY INC.
- Hsien-Wen HSU
- H03 - BASIC ELECTRONIC CIRCUITRY

Hsien-Wen HSU

Person

Patents Grantslast 30 patents

Manufacturing method and a related stackable chip package

Stacked package structure with encapsulation and redistribution lay...

Stacked package including exterior conductive element and a manufac...

Package process method including disposing a die within a recess of...

Carrier substrate

Apparatus and method for detecting lock error in sensorless motor

System and method for controlling sensorless motor

Apparatus and method for driving sensorless motor

High-side driver

Patents Applicationslast 30 patents

STACKED PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

Three-Mode Selection Electronically Commuted Motor

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD AND A RELATED STACKABLE CHIP PACKAGE

STACKED PACKAGE INCLUDING EXTERIOR CONDUCTIVE ELEMENT AND A MANUFAC...

STACKED PACKAGE AND A MANUFACTURING METHOD OF THE SAME

PACKAGE PROCESS METHOD INCLUDING DISPOSING A DIE WITHIN A RECESS OF...

MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE

CARRIER SUBSTRATE

SYSTEM AND METHOD FOR CONTROLLING SENSORLESS MOTOR

APPARATUS AND METHOD FOR DETECTING LOCK ERROR IN SENSORLESS MOTOR

APPARATUS AND METHOD FOR DRIVING SENSORLESS MOTOR

HIGH-SIDE DRIVER