Hsin-Chieh Yao

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Self-assembled dielectric on metal rie lines to increase reliability
- Patent number 12,362,231
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned interconnect structure
- Patent number 12,322,723
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric on wire structure to increase processing window for over...
- Patent number 12,315,817
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with carbon-...
- Patent number 12,300,541
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect conductive structure comprising two conductive materials
- Patent number 12,300,611
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Teng Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with an etch-stop layer forming a cavity
- Patent number 12,266,565
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double patterning approach by direct metal etch
- Patent number 12,243,775
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with inter-wire cavities
- Patent number 12,125,795
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and methods of forming the same
- Patent number 12,094,823
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure having air gap and method for formin...
- Patent number 11,972,975
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of a protective layer to reduce interconnect s...
- Patent number 11,942,364
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structure on interconnect wire to increase processing windo...
- Patent number 11,923,293
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall spacer structure enclosing conductive wire sidewalls to in...
- Patent number 11,854,965
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Teng Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual etch-stop layer structure
- Patent number 11,842,924
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with inter-wire cavities
- Patent number 11,842,966
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembled dielectric on metal RIE lines to increase reliability
- Patent number 11,798,840
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned interconnect structure
- Patent number 11,798,910
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and methods of forming the same
- Patent number 11,756,884
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,688,782
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 11,676,862
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hwei-Jay Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric on wire structure to increase processing window for over...
- Patent number 11,652,054
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double patterning approach by direct metal etch
- Patent number 11,569,127
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of a protective layer to reduce interconnect s...
- Patent number 11,521,896
- Issue date Dec 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned interconnect structure
- Patent number 11,488,926
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated chip having a cavity between metal...
- Patent number 11,482,447
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall spacer structure enclosing conductive wire sidewalls to in...
- Patent number 11,362,030
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Teng Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming the same
- Patent number 11,139,236
- Issue date Oct 5, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming interconnect structures in semiconductor fabrica...
- Patent number 10,847,417
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of double patterning lithography process using plurality of...
- Patent number 10,170,306
- Issue date Jan 1, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for dark field inspection
- Patent number 9,709,905
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Jiun Lin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
DOUBLE PATTERNING APPROACH BY DIRECT METAL ETCH
- Publication number 20250191973
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP WITH CAVITY STRUCTURE
- Publication number 20250191971
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250133800
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hwei-Jay CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH REINFORCING SPACER AND METHOD FOR MANUF...
- Publication number 20250125189
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250118656
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- HWEI-JAY CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250112087
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hwei-Jay CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240387383
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT CONDUCTIVE STRUCTURE COMPRISING TWO CONDUCTIVE MATERIALS
- Publication number 20240371770
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Teng Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP WITH INTER-WIRE CAVITIES
- Publication number 20240371779
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP
- Publication number 20240282623
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AIR GAP AND METHOD FOR MANUFACTURING TH...
- Publication number 20240266212
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF A PROTECTIVE LAYER TO REDUCE INTERCONNECT S...
- Publication number 20240194523
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER STRUCTURE ON INTERCONNECT WIRE TO INCREASE PROCESSING WINDO...
- Publication number 20240145380
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDEWALL SPACER STRUCTURE ENCLOSING CONDUCTIVE WIRE SIDEWALLS TO IN...
- Publication number 20240088022
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Teng Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL ETCH-STOP LAYER STRUCTURE
- Publication number 20240063057
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240021472
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hwei-Jay CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING INTERCONNECTS WITH LOWER CONTACT RES...
- Publication number 20230387022
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLED DIELECTRIC ON METAL RIE LINES TO INCREASE RELIABILITY
- Publication number 20230369108
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED INTERCONNECT STRUCTURE
- Publication number 20230369281
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP WITH INTER-WIRE CAVITIES
- Publication number 20230369231
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230361029
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20230335608
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC ON WIRE STRUCTURE TO INCREASE PROCESSING WINDOW FOR OVER...
- Publication number 20230275028
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CARBON-...
- Publication number 20230230881
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE PATTERNING APPROACH BY DIRECT METAL ETCH
- Publication number 20230170254
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230039661
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hwei-Jay CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT CONDUCTIVE STRUCTURE COMPRISING TWO CONDUCTIVE MATERIALS
- Publication number 20230009072
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Teng Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER STRUCTURE ON INTERCONNECT WIRE TO INCREASE PROCESSING WINDO...
- Publication number 20230011391
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHOD FOR FORMIN...
- Publication number 20220415704
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP WITH INTER-WIRE CAVITIES
- Publication number 20220415804
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS

Hsin-Chieh Yao

Person

Patents Grantslast 30 patents

Self-assembled dielectric on metal rie lines to increase reliability

Self-aligned interconnect structure

Dielectric on wire structure to increase processing window for over...

Structure and formation method of semiconductor device with carbon-...

Interconnect conductive structure comprising two conductive materials

Integrated chip with an etch-stop layer forming a cavity

Double patterning approach by direct metal etch

Integrated chip with inter-wire cavities

Interconnection structure and methods of forming the same

Semiconductor device structure having air gap and method for formin...

Selective deposition of a protective layer to reduce interconnect s...

Barrier structure on interconnect wire to increase processing windo...

Sidewall spacer structure enclosing conductive wire sidewalls to in...

Dual etch-stop layer structure

Integrated chip with inter-wire cavities

Self-assembled dielectric on metal RIE lines to increase reliability

Self-aligned interconnect structure

Interconnection structure and methods of forming the same

Semiconductor structure and method for forming the same

Semiconductor device structure and methods of forming the same

Dielectric on wire structure to increase processing window for over...

Double patterning approach by direct metal etch

Selective deposition of a protective layer to reduce interconnect s...

Self-aligned interconnect structure

Method of forming an integrated chip having a cavity between metal...

Sidewall spacer structure enclosing conductive wire sidewalls to in...

Semiconductor devices and methods of forming the same

Methods of forming interconnect structures in semiconductor fabrica...

Method of double patterning lithography process using plurality of...

System and method for dark field inspection

Patents Applicationslast 30 patents

DOUBLE PATTERNING APPROACH BY DIRECT METAL ETCH

INTEGRATED CHIP WITH CAVITY STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

INTERCONNECT STRUCTURE WITH REINFORCING SPACER AND METHOD FOR MANUF...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME

INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME

INTERCONNECT CONDUCTIVE STRUCTURE COMPRISING TWO CONDUCTIVE MATERIALS

INTEGRATED CHIP WITH INTER-WIRE CAVITIES

SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP

SEMICONDUCTOR DEVICE HAVING AIR GAP AND METHOD FOR MANUFACTURING TH...

SELECTIVE DEPOSITION OF A PROTECTIVE LAYER TO REDUCE INTERCONNECT S...

BARRIER STRUCTURE ON INTERCONNECT WIRE TO INCREASE PROCESSING WINDO...

SIDEWALL SPACER STRUCTURE ENCLOSING CONDUCTIVE WIRE SIDEWALLS TO IN...

DUAL ETCH-STOP LAYER STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE INCLUDING INTERCONNECTS WITH LOWER CONTACT RES...

SELF-ASSEMBLED DIELECTRIC ON METAL RIE LINES TO INCREASE RELIABILITY

SELF-ALIGNED INTERCONNECT STRUCTURE

INTEGRATED CHIP WITH INTER-WIRE CAVITIES

INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE

DIELECTRIC ON WIRE STRUCTURE TO INCREASE PROCESSING WINDOW FOR OVER...

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CARBON-...

DOUBLE PATTERNING APPROACH BY DIRECT METAL ETCH

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

INTERCONNECT CONDUCTIVE STRUCTURE COMPRISING TWO CONDUCTIVE MATERIALS

BARRIER STRUCTURE ON INTERCONNECT WIRE TO INCREASE PROCESSING WINDO...

SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHOD FOR FORMIN...

INTEGRATED CHIP WITH INTER-WIRE CAVITIES