Hsin Chih Peng

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming interconnect structure having a barrier layer
- Patent number 12,165,975
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image-guided adjustment to super-resolution operations
- Patent number 12,062,151
- Issue date Aug 13, 2024
- Mediatek Inc.
- Ming-En Shih
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnect structure and method of forming thereof
- Patent number 11,742,290
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High accuracy satellite receiving controller and associated method
- Patent number 8,223,070
- Issue date Jul 17, 2012
- MStar Semiconductor, Inc.
- Mikhail Vasilyev
- G01 - MEASURING TESTING
Information Patent Grant
Dual damascene process which prevents diffusion of metals and impro...
- Patent number 6,492,263
- Issue date Dec 10, 2002
- Mosel Vitelic, Inc.
- Hsin-Tang Peng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Interconnect Structure and Method of Forming Thereof
- Publication number 20240413087
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMATION
- Publication number 20240387381
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Thereof
- Publication number 20230361039
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMATION
- Publication number 20230299002
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURES WITH BOTTOM-LESS BARRIERS AND LINERS
- Publication number 20230029867
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Thereof
- Publication number 20220293528
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE-GUIDED ADJUSTMENT TO SUPER-RESOLUTION OPERATIONS
- Publication number 20210287338
- Publication date Sep 16, 2021
- MEDIATEK INC.
- Ming-En Shih
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGE PROCESSING APPARATUS USING ARTIFICIAL INTELLIGENCE SUPER-RESO...
- Publication number 20210287339
- Publication date Sep 16, 2021
- MEDIATEK INC.
- Ming-En Shih
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
High Accuracy Satellite Receiving Controller and Associated Method
- Publication number 20090262018
- Publication date Oct 22, 2009
- Mstar Semiconductor, Inc.
- Mikhail VASILYEV
- G01 - MEASURING TESTING
Information Patent Application
Apparatus For Suppressing EMI Generated In Differential High Freque...
- Publication number 20070291462
- Publication date Dec 20, 2007
- Hsin Chih Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hsin Chih Peng

Person

Patents Grantslast 30 patents

Method of forming interconnect structure having a barrier layer

Image-guided adjustment to super-resolution operations

Interconnect structure and method of forming thereof

High accuracy satellite receiving controller and associated method

Dual damascene process which prevents diffusion of metals and impro...

Patents Applicationslast 30 patents

Interconnect Structure and Method of Forming Thereof

SEMICONDUCTOR DEVICES AND METHODS OF FORMATION

Interconnect Structure and Method of Forming Thereof

SEMICONDUCTOR DEVICES AND METHODS OF FORMATION

CONDUCTIVE STRUCTURES WITH BOTTOM-LESS BARRIERS AND LINERS

Interconnect Structure and Method of Forming Thereof

IMAGE-GUIDED ADJUSTMENT TO SUPER-RESOLUTION OPERATIONS

IMAGE PROCESSING APPARATUS USING ARTIFICIAL INTELLIGENCE SUPER-RESO...

High Accuracy Satellite Receiving Controller and Associated Method

Apparatus For Suppressing EMI Generated In Differential High Freque...