Hsin Kuan

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Jhongli City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 10,714,528
- Issue date Jul 14, 2020
- Xintec Inc.
- Hsin Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 10,347,616
- Issue date Jul 9, 2019
- Xintec Inc.
- Hsin Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 10,109,663
- Issue date Oct 23, 2018
- Xintec Inc.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive component structure and manufacturing method thereof
- Patent number 9,761,555
- Issue date Sep 12, 2017
- Xintec Inc.
- Jiun-Yen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor stack structure and fabrication method thereof
- Patent number 9,177,862
- Issue date Nov 3, 2015
- Xintec Inc.
- Yen-Shih Ho
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190140012
- Publication date May 9, 2019
- XINTEC INC.
- Hsin KUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170330871
- Publication date Nov 16, 2017
- XINTEC INC.
- Hsin KUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20170092607
- Publication date Mar 30, 2017
- XINTEC INC.
- Hsin KUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20170077158
- Publication date Mar 16, 2017
- XINTEC INC.
- Yu-Lung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE COMPONENT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20150214162
- Publication date Jul 30, 2015
- XINTEC INC.
- Jiun-Yen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STACK STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20130168868
- Publication date Jul 4, 2013
- Xintec Inc.
- Yeh-Shih Ho
- B81 - MICRO-STRUCTURAL TECHNOLOGY