Hsin-Yi Liao

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating an encapsulated electronic package using a s...
- Patent number 11,195,812
- Issue date Dec 7, 2021
- Siliconware Precision Industries Co., Ltd.
- Hsin-Yi Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 11,114,412
- Issue date Sep 7, 2021
- Siliconware Precision Industries Co., Ltd.
- Hsin-Yi Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of wafer level package having a pressure sensor
- Patent number 9,487,393
- Issue date Nov 8, 2016
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure having MEMS element
- Patent number 9,254,994
- Issue date Feb 9, 2016
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package having a pressure sensor and fabrication method...
- Patent number 9,133,021
- Issue date Sep 15, 2015
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication method of semiconductor package
- Patent number 9,117,698
- Issue date Aug 25, 2015
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package with electronic component received in encapsulan...
- Patent number 9,040,361
- Issue date May 26, 2015
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having micro-electro-mechanical system element an...
- Patent number 8,878,356
- Issue date Nov 4, 2014
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having MEMS element
- Patent number 8,866,236
- Issue date Oct 21, 2014
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package, package structure and fabrication method the...
- Patent number 8,829,672
- Issue date Sep 9, 2014
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package
- Patent number 8,766,456
- Issue date Jul 1, 2014
- Siliconware Precision Industries Co., Ltd.
- Hsi-Chang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing package structure with micro-electromechan...
- Patent number 8,741,693
- Issue date Jun 3, 2014
- Siliconware Precision Industries Co., Ltd.
- Chun-An Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of package structure having MEMS element
- Patent number 8,716,070
- Issue date May 6, 2014
- Siliconware Precision Industries Co. Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for fabricating package structure having MEMS elements
- Patent number 8,633,048
- Issue date Jan 21, 2014
- Siliconware Precision Industries Co., Ltd.
- Chen-Han Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure with micro-electromechanical element and manufact...
- Patent number 8,610,272
- Issue date Dec 17, 2013
- Siliconware Precision Industries Co., Ltd.
- Chun-An Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 8,525,324
- Issue date Sep 3, 2013
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication method of package structure having MEMS element
- Patent number 8,420,430
- Issue date Apr 16, 2013
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure having MEMS elements and fabrication method thereof
- Patent number 8,399,940
- Issue date Mar 19, 2013
- Siliconware Precision Industries Co., Ltd.
- Chen-Han Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip scale package and fabrication method thereof
- Patent number 8,334,174
- Issue date Dec 18, 2012
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having MEMS element and fabrication method thereof
- Patent number 8,288,189
- Issue date Oct 16, 2012
- Siliconware Precision Industries Co., Ltd.
- Chun-An Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20210175196
- Publication date Jun 10, 2021
- Siliconware Precision Industries Co., Ltd.
- Hsin-Yi Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210104491
- Publication date Apr 8, 2021
- Siliconware Precision Industries Co., Ltd.
- Hsin-Yi Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF WAFER LEVEL PACKAGE HAVING A PRESSURE SENSOR
- Publication number 20150344299
- Publication date Dec 3, 2015
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE HAVING MEMS ELEMENT
- Publication number 20150102433
- Publication date Apr 16, 2015
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20140342507
- Publication date Nov 20, 2014
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20140117537
- Publication date May 1, 2014
- Siliconware Precision Industries Co., Ltd.
- Chen-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PACKAGE STRUCTURE WITH MICRO-ELECTROMECHAN...
- Publication number 20140080242
- Publication date Mar 20, 2014
- Siliconware Precision Industries Co., Ltd.
- Chun-An Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20140042638
- Publication date Feb 13, 2014
- Siliconware Precision Industries Co., Ltd.
- Hung-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20140035156
- Publication date Feb 6, 2014
- Siliconware Precision Industries Co., Ltd.
- Hsi-Chang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING MICRO-ELECTRO-MECHANICAL SYSTEM ELEMENT AN...
- Publication number 20130341739
- Publication date Dec 26, 2013
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE HAVING MEMS ELEMENT AND FABRICATION METHOD THEREOF
- Publication number 20130320463
- Publication date Dec 5, 2013
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE, PACKAGE STRUCTURE AND FABRICATION METHOD THE...
- Publication number 20130256875
- Publication date Oct 3, 2013
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF PACKAGE STRUCTURE HAVING MEMS ELEMENT
- Publication number 20130203200
- Publication date Aug 8, 2013
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20130075888
- Publication date Mar 28, 2013
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FABRICATING PACKAGE STRUCTURE HAVING MEMS ELEMENTS
- Publication number 20130017643
- Publication date Jan 17, 2013
- Siliconware Precision Industries Co., Ltd.
- Chen-Han LIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP-SCALE PACKAGE
- Publication number 20120313243
- Publication date Dec 13, 2012
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING MEMS ELEMENTS AND FABRICATION METHOD THEREOF
- Publication number 20120292722
- Publication date Nov 22, 2012
- Siliconware Precision Industries Co., Ltd.
- Chen-Han Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE WITH MICRO-ELECTROMECHANICAL ELEMENT AND MANUFACT...
- Publication number 20120104517
- Publication date May 3, 2012
- Siliconware Precision Industries Co., Ltd.
- Chun-An Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE WITH EMBEDDED CHIP AND METHOD OF FABRICATING THE SAME
- Publication number 20120086117
- Publication date Apr 12, 2012
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING MEMS ELEMENT AND FABRICATION METHOD THEREOF
- Publication number 20120056279
- Publication date Mar 8, 2012
- Siliconware Precision Industries Co., Ltd.
- Chun-An Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP SCALE PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20120038044
- Publication date Feb 16, 2012
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20120018870
- Publication date Jan 26, 2012
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE HAVING A PRESSURE SENSOR AND FABRICATION METHOD...
- Publication number 20120001274
- Publication date Jan 5, 2012
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FABRICATION METHOD OF PACKAGE STRUCTURE HAVING MEMS ELEMENT
- Publication number 20110177643
- Publication date Jul 21, 2011
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE HAVING MEMS ELEMENT
- Publication number 20110175179
- Publication date Jul 21, 2011
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Hsin-Yi Liao

Person

Patents Grantslast 30 patents

Method for fabricating an encapsulated electronic package using a s...

Electronic package and method for fabricating the same

Fabrication method of wafer level package having a pressure sensor

Package structure having MEMS element

Wafer level package having a pressure sensor and fabrication method...

Fabrication method of semiconductor package

Chip scale package with electronic component received in encapsulan...

Package structure having micro-electro-mechanical system element an...

Package structure having MEMS element

Semiconductor package, package structure and fabrication method the...

Method of fabricating a semiconductor package

Method for manufacturing package structure with micro-electromechan...

Fabrication method of package structure having MEMS element

Method for fabricating package structure having MEMS elements

Package structure with micro-electromechanical element and manufact...

Semiconductor package and method of fabricating the same

Fabrication method of package structure having MEMS element

Package structure having MEMS elements and fabrication method thereof

Chip scale package and fabrication method thereof

Package structure having MEMS element and fabrication method thereof

Patents Applicationslast 30 patents

METHOD FOR FABRICATING ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

FABRICATION METHOD OF WAFER LEVEL PACKAGE HAVING A PRESSURE SENSOR

PACKAGE STRUCTURE HAVING MEMS ELEMENT

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD FOR MANUFACTURING PACKAGE STRUCTURE WITH MICRO-ELECTROMECHAN...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE HAVING MICRO-ELECTRO-MECHANICAL SYSTEM ELEMENT AN...

PACKAGE STRUCTURE HAVING MEMS ELEMENT AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE, PACKAGE STRUCTURE AND FABRICATION METHOD THE...

FABRICATION METHOD OF PACKAGE STRUCTURE HAVING MEMS ELEMENT

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD FOR FABRICATING PACKAGE STRUCTURE HAVING MEMS ELEMENTS

CHIP-SCALE PACKAGE

PACKAGE STRUCTURE HAVING MEMS ELEMENTS AND FABRICATION METHOD THEREOF

PACKAGE STRUCTURE WITH MICRO-ELECTROMECHANICAL ELEMENT AND MANUFACT...

PACKAGE WITH EMBEDDED CHIP AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE HAVING MEMS ELEMENT AND FABRICATION METHOD THEREOF

CHIP SCALE PACKAGE AND FABRICATION METHOD THEREOF

CHIP SCALE PACKAGE AND FABRICATION METHOD THEREOF

WAFER LEVEL PACKAGE HAVING A PRESSURE SENSOR AND FABRICATION METHOD...

FABRICATION METHOD OF PACKAGE STRUCTURE HAVING MEMS ELEMENT

PACKAGE STRUCTURE HAVING MEMS ELEMENT