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Hsin-Yu Pan

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  • Taipei, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD OF FABRICATING PACKAGE STRUCTURE
    • Publication number 20240312904
    • Publication date Sep 19, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Sen-Kuei Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240304561
    • Publication date Sep 12, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Sen-Kuei Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT PACKAGE AND METHOD
    • Publication number 20240274483
    • Publication date Aug 15, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Teng-Yuan Lo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT PACKAGES AND METHODS
    • Publication number 20240234340
    • Publication date Jul 11, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Yi-Che Chiang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20240194619
    • Publication date Jun 13, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Sen-Kuei Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Conductive Traces in Semiconductor Devices and Methods of Forming Same
    • Publication number 20240136280
    • Publication date Apr 25, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chao-Wen Shih
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240128232
    • Publication date Apr 18, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tsung-Ding Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20240071888
    • Publication date Feb 29, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chien-Chang Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    • Publication number 20240047436
    • Publication date Feb 8, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tzuan-Horng Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20230378152
    • Publication date Nov 23, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Sen-Kuei Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATION BLOCK AND MANUFACTURI...
    • Publication number 20230378151
    • Publication date Nov 23, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Shih-Wei Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230369263
    • Publication date Nov 16, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Kris Lipu Chuang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20230361078
    • Publication date Nov 9, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Shih-Wei Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20230343764
    • Publication date Oct 26, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Lipu Kris Chuang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20230307404
    • Publication date Sep 28, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Cheng-Yu Kuo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
    • Publication number 20230307305
    • Publication date Sep 28, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Jung-Wei Cheng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230307385
    • Publication date Sep 28, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chi-Yang Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
    • Publication number 20230268260
    • Publication date Aug 24, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Kris Lipu Chuang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    • Publication number 20230260944
    • Publication date Aug 17, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • CHIH-TING LAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Interconnect Structure of Semiconductor Package and Method of Formi...
    • Publication number 20230223357
    • Publication date Jul 13, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Yi-Che Chiang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230061943
    • Publication date Mar 2, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Sen-Kuei Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT PACKAGE AND METHOD
    • Publication number 20220367301
    • Publication date Nov 17, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Teng-Yuan Lo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
    • Publication number 20220359347
    • Publication date Nov 10, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Lipu Kris Chuang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...
    • Publication number 20220359382
    • Publication date Nov 10, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Sen-Kuei Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIA...
    • Publication number 20220285241
    • Publication date Sep 8, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Sen-Kuei Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220270987
    • Publication date Aug 25, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chi-Yang Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    • Publication number 20220238505
    • Publication date Jul 28, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Shih-Wei Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20220216194
    • Publication date Jul 7, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Sen-Kuei Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20220102314
    • Publication date Mar 31, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Shih-Wei Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT PACKAGE AND METHOD
    • Publication number 20220068736
    • Publication date Mar 3, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Teng-Yuan Lo
    • H01 - BASIC ELECTRIC ELEMENTS