Hsing-Chou Hsu

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Taipei Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Arrangement of non-signal through vias and wiring board applying th...
- Patent number 7,615,708
- Issue date Nov 10, 2009
- VIA Technologies, Inc.
- Hsing-Chou Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip structure with arrangement of side pads
- Patent number 7,449,788
- Issue date Nov 11, 2008
- VIA Technologies, Inc.
- Yuan-Tsang Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal transmission structure and circuit substrate thereof
- Patent number 7,291,916
- Issue date Nov 6, 2007
- VIA Technologies, Inc.
- Chi-Hsing Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Differential signal transmission structure, wiring board, and chip...
- Publication number 20070194434
- Publication date Aug 23, 2007
- Chin-Sung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Arrangement of non-signal through vias and wiring board applying th...
- Publication number 20070194432
- Publication date Aug 23, 2007
- Hsing-Chou Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead arrangement and chip package using the same
- Publication number 20070102794
- Publication date May 10, 2007
- Chao-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip structure with arrangement of side pads
- Publication number 20060261496
- Publication date Nov 23, 2006
- Yuan-Tsang Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Signal transmission structure and circuit substrate thereof
- Publication number 20060065434
- Publication date Mar 30, 2006
- Chi-Hsing Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR