Hsing-Kuo Hsia

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Structure and process for photonic packages
- Patent number 12,135,454
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 12,092,861
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor devices with vertically stacked and laterally offset...
- Patent number 12,066,671
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Tse Tang
- G02 - OPTICS
Information Patent Grant
Hybrid integrated circuit package
- Patent number 12,068,297
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including photonic package and interposer having...
- Patent number 12,044,892
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Grant
Photonic package and method of manufacture
- Patent number 12,038,599
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,015,023
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having grating coupler and manufacturing method t...
- Patent number 12,007,611
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Wei Kuo
- G02 - OPTICS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,973,074
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices, systems, and methods for optical signal processing
- Patent number 11,960,122
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Wei Kuo
- G02 - OPTICS
Information Patent Grant
Grating coupler and method of manufacturing the same
- Patent number 11,953,725
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,852,868
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,830,841
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method
- Patent number 11,830,864
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated 3DIC with stacked photonic dies and method forming same
- Patent number 11,796,735
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,747,563
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsing-Kuo Hsia
- G02 - OPTICS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,715,728
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Grant
Hybrid integrated circuit package and method
- Patent number 11,605,621
- Issue date Mar 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method
- Patent number 11,605,622
- Issue date Mar 14, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Chieh Chang
- G02 - OPTICS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,592,618
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsing-Kuo Hsia
- G02 - OPTICS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,493,689
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Grant
Optical transceiver and manufacturing method thereof
- Patent number 11,454,773
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method
- Patent number 11,362,077
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor package and method for manufacturing the same
- Patent number 11,322,470
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method
- Patent number 11,156,772
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Grant
Method of forming a dummy die of an integrated circuit having an em...
- Patent number 11,101,260
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages
- Patent number 10,996,410
- Issue date May 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- G02 - OPTICS
Information Patent Grant
Hybrid integrated circuit package and method
- Patent number 10,937,736
- Issue date Mar 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method
- Patent number 10,930,628
- Issue date Feb 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit package and method
- Patent number 10,867,982
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...
- Publication number 20240427097
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
OPTICAL CONNECTION STRUCTURES FOR A PHOTONIC ASSEMBLY AND METHODS F...
- Publication number 20240427091
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240387489
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chia LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED 3DIC WITH STACKED PHOTONIC DIES AND METHOD FORMING SAME
- Publication number 20240385367
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240385377
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Kuo Hsia
- G02 - OPTICS
Information Patent Application
Photonic Package and Method of Manufacture
- Publication number 20240385378
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Fu Tsai
- G02 - OPTICS
Information Patent Application
OPTICAL TRANSCEIVER AND MANUFACTURING METHOD THEREOF
- Publication number 20240385398
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240377662
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming Lee
- G02 - OPTICS
Information Patent Application
OPTICAL DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240377660
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming Lee
- G02 - OPTICS
Information Patent Application
OPTICAL COUPLING STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20240369783
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICES WITH VERTICALLY STACKED WAVEGUIDES
- Publication number 20240369785
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Tse Tang
- G02 - OPTICS
Information Patent Application
HYBRID INTEGRATED CIRCUIT PACKAGES
- Publication number 20240363610
- Publication date Oct 31, 2024
- Taiwan Semiconductor Mamufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240361520
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE AND INTERPOSER HAVING...
- Publication number 20240337800
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Package and Method of Manufacture
- Publication number 20240329302
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240329336
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- G02 - OPTICS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240297166
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING GRATING COUPLER AND MANUFACTURING METHOD T...
- Publication number 20240280765
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei KUO
- G02 - OPTICS
Information Patent Application
Photonic Semiconductor Device and Method of Manufacture
- Publication number 20240266338
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRATING COUPLER AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240210619
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR OPTICAL SIGNAL PROCESSING
- Publication number 20240210628
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei Kuo
- G02 - OPTICS
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE, PHOTONIC SEMICONDUCTOR PACKAGE USING...
- Publication number 20240118491
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao YU
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20240113056
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Kuo Hsia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240103220
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
Optical Device and Method of Manufacture
- Publication number 20240103218
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Kuo Hsia
- G02 - OPTICS
Information Patent Application
Optical Engine Including Fiber Deflection Unit and Method Forming t...
- Publication number 20240103236
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Tseng
- G02 - OPTICS
Information Patent Application
Optical Device and Method of Manufacture
- Publication number 20240107781
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Kuo Hsia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages With Photonic Engines and Method of Forming the Same
- Publication number 20240094469
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Kuo Hsia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Signal Communication Through Optical-Engine Based Interconnect Comp...
- Publication number 20240085621
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Kuo Hsia
- G02 - OPTICS
Information Patent Application
Photonic Package and Method of Manufacture
- Publication number 20240085610
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS

Hsing-Kuo Hsia

Person

Patents Grantslast 30 patents

Structure and process for photonic packages

Photonic semiconductor device and method of manufacture

Semiconductor devices with vertically stacked and laterally offset...

Hybrid integrated circuit package

Package structure including photonic package and interposer having...

Photonic package and method of manufacture

Integrated circuit package and method of forming same

Package structure having grating coupler and manufacturing method t...

Photonic semiconductor device and method of manufacture

Devices, systems, and methods for optical signal processing

Grating coupler and method of manufacturing the same

Photonic semiconductor device and method of manufacture

Semiconductor package and method for manufacturing the same

Photonic semiconductor device and method

Integrated 3DIC with stacked photonic dies and method forming same

Photonic semiconductor device and method of manufacture

Photonic semiconductor device and method of manufacture

Hybrid integrated circuit package and method

Photonic semiconductor device and method

Photonic semiconductor device and method of manufacture

Photonic semiconductor device and method of manufacture

Optical transceiver and manufacturing method thereof

Photonic semiconductor device and method

Optical semiconductor package and method for manufacturing the same

Photonic semiconductor device and method

Method of forming a dummy die of an integrated circuit having an em...

Methods of forming semiconductor packages

Hybrid integrated circuit package and method

Photonic semiconductor device and method

Hybrid integrated circuit package and method

Patents Applicationslast 30 patents

OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...

OPTICAL CONNECTION STRUCTURES FOR A PHOTONIC ASSEMBLY AND METHODS F...

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

INTEGRATED 3DIC WITH STACKED PHOTONIC DIES AND METHOD FORMING SAME

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

Photonic Package and Method of Manufacture

OPTICAL TRANSCEIVER AND MANUFACTURING METHOD THEREOF

OPTICAL DEVICES AND METHODS OF MANUFACTURE

OPTICAL DEVICES AND METHODS OF MANUFACTURE

OPTICAL COUPLING STRUCTURE FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES WITH VERTICALLY STACKED WAVEGUIDES

HYBRID INTEGRATED CIRCUIT PACKAGES

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE AND INTERPOSER HAVING...

Photonic Package and Method of Manufacture

PHOTONIC DEVICE AND METHOD OF MANUFACTURE

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

PACKAGE STRUCTURE HAVING GRATING COUPLER AND MANUFACTURING METHOD T...

Photonic Semiconductor Device and Method of Manufacture

GRATING COUPLER AND METHOD OF MANUFACTURING THE SAME

DEVICES, SYSTEMS, AND METHODS FOR OPTICAL SIGNAL PROCESSING

PHOTONIC SEMICONDUCTOR DEVICE, PHOTONIC SEMICONDUCTOR PACKAGE USING...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

Optical Device and Method of Manufacture

Optical Engine Including Fiber Deflection Unit and Method Forming t...

Optical Device and Method of Manufacture

Packages With Photonic Engines and Method of Forming the Same

Signal Communication Through Optical-Engine Based Interconnect Comp...

Photonic Package and Method of Manufacture