Hsing Kuo TIEN

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 12,040,287
- Issue date Jul 16, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsing Kuo Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and method for manufacturing the same
- Patent number 11,997,798
- Issue date May 28, 2024
- Advanced Semiconductor Engineering, Inc.
- Wu Chou Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor device package and method of ma...
- Patent number 11,830,834
- Issue date Nov 28, 2023
- Advanced Semiconductor Engineering, Inc.
- Hsing Kuo Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including stress buffering layer
- Patent number 11,721,678
- Issue date Aug 8, 2023
- Advanced Semiconductor Engineering, Inc.
- Chien-Mei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded component package structure having a magnetically permeabl...
- Patent number 11,715,694
- Issue date Aug 1, 2023
- Advanced Semiconductor Engineering, Inc.
- Hsing Kuo Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 11,469,186
- Issue date Oct 11, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsing Kuo Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate
- Patent number 11,432,406
- Issue date Aug 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Wu Chou Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate, electronic device package and method for manufac...
- Patent number 11,335,650
- Issue date May 17, 2022
- Advanced Semiconductor Engineering, Inc.
- Wu Chou Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded component package structure and manufacturing method thereof
- Patent number 11,062,996
- Issue date Jul 13, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsing Kuo Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with stress buffering layer and method...
- Patent number 11,018,120
- Issue date May 25, 2021
- Advanced Semiconductor Engineering, Inc.
- Chien-Mei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded component package structure and method of manufacturing th...
- Patent number 10,276,507
- Issue date Apr 30, 2019
- Advanced Semiconductor Engineering, Inc.
- Chih-Cheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,997,442
- Issue date Jun 12, 2018
- Advanced Semiconductor Engineering, Inc.
- Chai-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded component package structure and method of manufacturing th...
- Patent number 9,887,167
- Issue date Feb 6, 2018
- Advanced Semiconductor Engineering, Inc.
- Chih Cheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded component package structure and method of manufacturing th...
- Patent number 9,721,899
- Issue date Aug 1, 2017
- Advanced Semiconductor Engineering, Inc.
- Chih-Cheng Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE INCLUDING STRESS BUFFERING LAYER
- Publication number 20230387092
- Publication date Nov 30, 2023
- Advanced Semiconductor Engineering, Inc.
- Chien-Mei HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230033515
- Publication date Feb 2, 2023
- Advanced Semiconductor Engineering, Inc.
- Hsing Kuo TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MA...
- Publication number 20230009219
- Publication date Jan 12, 2023
- Advanced Semiconductor Engineering, Inc.
- Hsing Kuo TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220418115
- Publication date Dec 29, 2022
- Advanced Semiconductor Engineering, Inc.
- Wu Chou HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE, ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFAC...
- Publication number 20220157745
- Publication date May 19, 2022
- Advanced Semiconductor Engineering, Inc.
- Wu Chou HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220095462
- Publication date Mar 24, 2022
- Advanced Semiconductor Engineering, Inc.
- Wu Chou HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220028801
- Publication date Jan 27, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsing Kuo TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE, ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFAC...
- Publication number 20210391283
- Publication date Dec 16, 2021
- Advanced Semiconductor Engineering, Inc.
- Wu Chou HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE, ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFAC...
- Publication number 20210391284
- Publication date Dec 16, 2021
- Advanced Semiconductor Engineering, Inc.
- Wu Chou HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210343648
- Publication date Nov 4, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsing Kuo TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210280565
- Publication date Sep 9, 2021
- Advanced Semiconductor Engineering, Inc.
- Chien-Mei HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210035912
- Publication date Feb 4, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsing Kuo TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200388600
- Publication date Dec 10, 2020
- Advanced Semiconductor Engineering, Inc.
- Chien-Mei HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180166370
- Publication date Jun 14, 2018
- Advanced Semiconductor Engineering, Inc.
- Chai-Chi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COMPONENT PACKAGE STRUCTURE AND METHOD OF MANUFACTURING TH...
- Publication number 20170301626
- Publication date Oct 19, 2017
- Advanced Semiconductor Engineering, Inc.
- Chih-Cheng LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COMPONENT PACKAGE STRUCTURE AND METHOD OF MANUFACTURING TH...
- Publication number 20160064329
- Publication date Mar 3, 2016
- Advanced Semiconductor Engineering, Inc.
- Chih-Cheng LEE
- H01 - BASIC ELECTRIC ELEMENTS

Hsing Kuo TIEN

Person

Patents Grantslast 30 patents

Semiconductor device package and method for manufacturing the same

Package substrate and method for manufacturing the same

Semiconductor device, semiconductor device package and method of ma...

Semiconductor device package including stress buffering layer

Embedded component package structure having a magnetically permeabl...

Semiconductor device package and method for manufacturing the same

Package substrate

Package substrate, electronic device package and method for manufac...

Embedded component package structure and manufacturing method thereof

Semiconductor device package with stress buffering layer and method...

Embedded component package structure and method of manufacturing th...

Semiconductor device and method of manufacturing the same

Embedded component package structure and method of manufacturing th...

Embedded component package structure and method of manufacturing th...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE INCLUDING STRESS BUFFERING LAYER

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MA...

PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE SUBSTRATE, ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFAC...

PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE SUBSTRATE, ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFAC...

PACKAGE SUBSTRATE, ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFAC...

EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

EMBEDDED COMPONENT PACKAGE STRUCTURE AND METHOD OF MANUFACTURING TH...

EMBEDDED COMPONENT PACKAGE STRUCTURE AND METHOD OF MANUFACTURING TH...