Hsing-Lung SHEN

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,873,212
- Issue date Jan 16, 2024
- Xintec Inc.
- Wei-Luen Suen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical chip package and method for forming the same
- Patent number 11,137,559
- Issue date Oct 5, 2021
- Xintec Inc.
- Jiun-Yen Lai
- G02 - OPTICS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,107,759
- Issue date Aug 31, 2021
- Xintec Inc.
- Wei-Luen Suen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and fabrication method thereof
- Patent number 10,049,252
- Issue date Aug 14, 2018
- Xintec Inc.
- Yen-Shih Ho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,972,584
- Issue date May 15, 2018
- Xintec Inc.
- Hsing-Lung Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,793,234
- Issue date Oct 17, 2017
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,548,265
- Issue date Jan 17, 2017
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240109769
- Publication date Apr 4, 2024
- XINTEC INC.
- Wei-Luen SUEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210269303
- Publication date Sep 2, 2021
- XINTEC INC.
- Wei-Luen SUEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20210210538
- Publication date Jul 8, 2021
- XINTEC INC.
- Jiun-Yen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210104455
- Publication date Apr 8, 2021
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20200333542
- Publication date Oct 22, 2020
- XINTEC INC.
- Jiun-Yen LAI
- G02 - OPTICS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20170207194
- Publication date Jul 20, 2017
- XINTEC INC.
- Hsing-Lung SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20160322312
- Publication date Nov 3, 2016
- XINTEC INC.
- Hsing-Lung SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELECTROPLATING SYSTEM
- Publication number 20160315048
- Publication date Oct 27, 2016
- XINTEC INC.
- Yen-Shih HO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20160315061
- Publication date Oct 27, 2016
- XINTEC INC.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20160315043
- Publication date Oct 27, 2016
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20160240520
- Publication date Aug 18, 2016
- XINTEC INC.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160171273
- Publication date Jun 16, 2016
- XINTEC INC.
- Yen-Shih HO
- G06 - COMPUTING CALCULATING COUNTING

Hsing-Lung SHEN

Person

Patents Grantslast 30 patents

Chip package and manufacturing method thereof

Optical chip package and method for forming the same

Chip package and manufacturing method thereof

Chip package and fabrication method thereof

Chip package and manufacturing method thereof

Chip package and manufacturing method thereof

Chip package and manufacturing method thereof

Patents Applicationslast 30 patents

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

OPTICAL CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR ELECTROPLATING SYSTEM

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND FABRICATION METHOD THEREOF