Hsingya Arthur WANG

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Milpitas, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Wafer-bonding structure and method of forming thereof
- Patent number 12,021,059
- Issue date Jun 25, 2024
- Integrated Silicon Solution Inc.
- Hsingya Arthur Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FINFET stack gate memory and method of forming thereof
- Patent number 11,616,145
- Issue date Mar 28, 2023
- Integrated Silicon Solution Inc.
- Hsingya Arthur Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FINFET STACK GATE MEMORY AND MEHOD OF FORMING THEREOF
- Publication number 20220123146
- Publication date Apr 21, 2022
- Integrated Silicon Solution Inc.
- Hsingya Arthur WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-BONDING STRUCTURE AND METHOD OF FORMING THEREOF
- Publication number 20220020721
- Publication date Jan 20, 2022
- Integrated Silicon Solution Inc.
- Hsingya Arthur WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-BONDING STRUCTURE AND METHOD OF FORMING THEREOF
- Publication number 20210296281
- Publication date Sep 23, 2021
- Integrated Silicon Solution Inc.
- Hsingya Arthur WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET STACK GATE MEMORY AND MEHOD OF FORMING THEREOF
- Publication number 20210143275
- Publication date May 13, 2021
- Integrated Silicon Solution Inc.
- Hsingya Arthur WANG
- H01 - BASIC ELECTRIC ELEMENTS