Hsiu-Chi LIU

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure including reinforcement component a...
- Patent number 11,798,858
- Issue date Oct 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Meng-Wei Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including a reinforcement structure on...
- Patent number 11,342,282
- Issue date May 24, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Chiang Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,094,649
- Issue date Aug 17, 2021
- Advanced Semiconductor Engineering, Inc.
- Fan-Yu Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 10,943,843
- Issue date Mar 9, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsiu-Chi Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230017013
- Publication date Jan 19, 2023
- Advanced Semiconductor Engineering, Inc.
- Meng-Wei HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220359425
- Publication date Nov 10, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Chiang SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210265280
- Publication date Aug 26, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Chiang SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210225781
- Publication date Jul 22, 2021
- Advanced Semiconductor Engineering, Inc.
- Fan-Yu MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20200219845
- Publication date Jul 9, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsiu-Chi LIU
- H01 - BASIC ELECTRIC ELEMENTS