Hsiu-Fang Chien

Person

Taichung Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Carrier structure
- Patent number 12,219,693
- Issue date Feb 4, 2025
- Siliconware Precision Industries Co., Ltd.
- Chin-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof, and substrate...
- Patent number 12,154,848
- Issue date Nov 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Chia-Wen Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, electronic package and packaging substrate thereof
- Patent number 11,437,325
- Issue date Sep 6, 2022
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND SUBSTRATE...
- Publication number 20250038097
- Publication date Jan 30, 2025
- Siliconware Precision Industries Co., Ltd.
- Chia-Wen TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE
- Publication number 20240266302
- Publication date Aug 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Chung-Yan HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND SUBSTRATE...
- Publication number 20240145372
- Publication date May 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Chia-Wen TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE
- Publication number 20240049382
- Publication date Feb 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Chin-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240047336
- Publication date Feb 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Ching-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20230343692
- Publication date Oct 26, 2023
- Siliconware Precision Industries Co., Ltd.
- Wen-Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20230253342
- Publication date Aug 10, 2023
- Siliconware Precision Industries Co., Ltd.
- Hsiu-Fang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC PACKAGE AND PACKAGING SUBSTRATE THEREOF
- Publication number 20210358851
- Publication date Nov 18, 2021
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with flash-absorbing mechanism and fabricatio...
- Publication number 20060076695
- Publication date Apr 13, 2006
- Siliconware Precision Industries Co., Ltd.
- Wen-Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Hsiu-Fang Chien

Person

Patents Grantslast 30 patents

Carrier structure

Electronic package and manufacturing method thereof, and substrate...

Electronic device, electronic package and packaging substrate thereof

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND SUBSTRATE...

CARRIER SUBSTRATE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND SUBSTRATE...

CARRIER STRUCTURE

ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF

ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF

ELECTRONIC DEVICE, ELECTRONIC PACKAGE AND PACKAGING SUBSTRATE THEREOF

Semiconductor package with flash-absorbing mechanism and fabricatio...