Hsiu-Hsin Chung

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Bonding pad structure for integrated circuit (I)
- Patent number 6,002,179
- Issue date Dec 14, 1999
- Winbond Electronics Corporation
- Chin-Jong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure for integrated circuit (III)
- Patent number 5,962,919
- Issue date Oct 5, 1999
- Winbond Electronics Corp.
- Wen-Hao Liang
- H01 - BASIC ELECTRIC ELEMENTS