Hsiu-Jen Wang

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Advanced-packaging high-volume-mode digital-lithography-tool
- Patent number 12,032,284
- Issue date Jul 9, 2024
- Applied Materials, Inc.
- Shih-Hao Kuo
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Dynamic imaging system
- Patent number 10,948,834
- Issue date Mar 16, 2021
- Applied Materials, Inc.
- Ching-Chang Chen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Multi-substrate processing on digital lithography systems
- Patent number 10,928,743
- Issue date Feb 23, 2021
- Applied Materials, Inc.
- Chien-Hua Lai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Dynamic imaging system
- Patent number 10,719,018
- Issue date Jul 21, 2020
- Applied Materials, Inc.
- Ching-Chang Chen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Multi-configuration digital lithography system
- Patent number 10,459,341
- Issue date Oct 29, 2019
- Applied Materials, Inc.
- Chien-Hua Lai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
ADVANCED-PACKAGING HIGH-VOLUME-MODE DIGITAL-LITHOGRAPHY-TOOL
- Publication number 20240027896
- Publication date Jan 25, 2024
- Applied Materials, Inc.
- Shih-Hao Kuo
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PACKAGE IMAGING FOR DIE LOCATION CORRECTION IN DIGITAL LITHOGRAPHY
- Publication number 20230288822
- Publication date Sep 14, 2023
- Applied Materials, Inc.
- Ulrich Mueller
- G01 - MEASURING TESTING
Information Patent Application
MULTIPLE SUBSTRATE HANDLING SYSTEM AND METHOD
- Publication number 20230260815
- Publication date Aug 17, 2023
- Applied Materials, Inc.
- Hsiu-jen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC IMAGING SYSTEM
- Publication number 20200333711
- Publication date Oct 22, 2020
- Applied Materials, Inc.
- Ching-Chang CHEN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
DYNAMIC IMAGING SYSTEM
- Publication number 20200019065
- Publication date Jan 16, 2020
- Applied Materials, Inc.
- Ching-Chang CHEN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
MULTI-SUBSTRATE PROCESSING ON DIGITAL LITHOGRAPHY SYSTEMS
- Publication number 20190369499
- Publication date Dec 5, 2019
- Applied Materials, Inc.
- Chien-Hua LAI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
MULTI-CONFIGURATION DIGITAL LITHOGRAPHY SYSTEM
- Publication number 20190235389
- Publication date Aug 1, 2019
- Applied Materials, Inc.
- Chien-Hua Lai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Hsiu-Jen Wang

Person

Patents Grantslast 30 patents

Advanced-packaging high-volume-mode digital-lithography-tool

Dynamic imaging system

Multi-substrate processing on digital lithography systems

Dynamic imaging system

Multi-configuration digital lithography system

Patents Applicationslast 30 patents

ADVANCED-PACKAGING HIGH-VOLUME-MODE DIGITAL-LITHOGRAPHY-TOOL

PACKAGE IMAGING FOR DIE LOCATION CORRECTION IN DIGITAL LITHOGRAPHY

MULTIPLE SUBSTRATE HANDLING SYSTEM AND METHOD

DYNAMIC IMAGING SYSTEM

DYNAMIC IMAGING SYSTEM

MULTI-SUBSTRATE PROCESSING ON DIGITAL LITHOGRAPHY SYSTEMS

MULTI-CONFIGURATION DIGITAL LITHOGRAPHY SYSTEM