TREA

Hsiu-Ping Wei

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  • Dajia Town, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Bump pad structure
    • Patent number 9,536,847
    • Issue date Jan 3, 2017
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hsiu-Ping Wei
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bump pad structure
    • Patent number 9,171,811
    • Issue date Oct 27, 2015
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hao-Yi Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bump pad structure
    • Patent number 8,907,478
    • Issue date Dec 9, 2014
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hao-Yi Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Dummy metal design for packaging structures
    • Patent number 8,753,971
    • Issue date Jun 17, 2014
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tzuan-Horng Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bump pad structure
    • Patent number 8,405,211
    • Issue date Mar 26, 2013
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hao-Yi Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Package structure and method for reducing dielectric layer delamina...
    • Patent number 8,227,916
    • Issue date Jul 24, 2012
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hsiu-Ping Wei
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Dummy metal design for packaging structures
    • Patent number 8,193,639
    • Issue date Jun 5, 2012
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tzuan-Horng Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Integrated circuit with protective structure
    • Patent number 8,030,776
    • Issue date Oct 4, 2011
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Bump Pad Structure
    • Publication number 20160035684
    • Publication date Feb 4, 2016
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hsiu-Ping Wei
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bump Pad Structure
    • Publication number 20150031200
    • Publication date Jan 29, 2015
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hao-Yi Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bump Pad Structure
    • Publication number 20130181347
    • Publication date Jul 18, 2013
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hao-Yi Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Dummy Metal Design for Packaging Structures
    • Publication number 20120178252
    • Publication date Jul 12, 2012
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tzuan-Horng Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Dummy Metal Design for Packaging Structures
    • Publication number 20110241202
    • Publication date Oct 6, 2011
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tzuan-Horng Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT WITH PROTECTIVE STRUCTURE, AND METHOD OF FABRICA...
    • Publication number 20110079922
    • Publication date Apr 7, 2011
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND METHOD FOR REDUCING DIELECTRIC LAYER DELAMINA...
    • Publication number 20110018128
    • Publication date Jan 27, 2011
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hsiu-Ping WEI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bump Pad Structure
    • Publication number 20100283148
    • Publication date Nov 11, 2010
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hao-Yi Tsai
    • H01 - BASIC ELECTRIC ELEMENTS