Hsiu Wen HSU

Person

Xinfeng Shiang, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Trench power semiconductor component and method of manufacturing th...
- Patent number 11,289,587
- Issue date Mar 29, 2022
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- Hsiu-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench power seminconductor device and manufacturing method thereof
- Patent number 11,049,950
- Issue date Jun 29, 2021
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- Hsiu-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power device and manufacturing method thereof
- Patent number 11,049,958
- Issue date Jun 29, 2021
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- Sung-Nien Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench power semiconductor and method of making the same
- Patent number 10,680,076
- Issue date Jun 9, 2020
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- Hsiu-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a chip package structure
- Patent number 10,629,452
- Issue date Apr 21, 2020
- Niko Semiconductor Co., Ltd.
- Chih-Cheng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a trench power semiconductor device
- Patent number 10,559,674
- Issue date Feb 11, 2020
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- Hsiu-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench power semiconductor component and method of manufacturing th...
- Patent number 10,529,847
- Issue date Jan 7, 2020
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- Hsiu-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench power semiconductor and method of making the same
- Patent number 10,516,027
- Issue date Dec 24, 2019
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- Hsiu-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench power semiconductor component and method of manufacturing th...
- Patent number 10,497,782
- Issue date Dec 3, 2019
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- Hsiu-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench power semiconductor device and manufacturing method thereof
- Patent number 10,446,658
- Issue date Oct 15, 2019
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- Hsiu-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level chip package structure
- Patent number 10,381,268
- Issue date Aug 13, 2019
- Niko Semiconductor Co., Ltd.
- Chih-Cheng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super-junction semiconductor device
- Patent number 10,014,369
- Issue date Jul 3, 2018
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- Sung-Nien Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 9,947,551
- Issue date Apr 17, 2018
- Niko Semiconductor Co., Ltd.
- Chih-Cheng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of ultra-thin semiconductor device package ass...
- Patent number 9,881,897
- Issue date Jan 30, 2018
- Niko Semiconductor Co., Ltd.
- Chih-Cheng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench power transistor structure and manufacturing method thereof
- Patent number 9,876,106
- Issue date Jan 23, 2018
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- Hsiu-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of trench power MOSFET
- Patent number 9,837,508
- Issue date Dec 5, 2017
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- Hsiu-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level chip package structure and manufacturing method...
- Patent number 9,799,563
- Issue date Oct 24, 2017
- Niko Semiconductor Co., Ltd.
- Chih-Cheng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench power MOSFET and manufacturing method thereof
- Patent number 9,536,972
- Issue date Jan 3, 2017
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- Hsiu-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench power MOSFET and manufacturing method thereof
- Patent number 9,349,857
- Issue date May 24, 2016
- Super Group Semiconductor Co., Ltd.
- Hsiu-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of wafer level chip scale package structure
- Patent number 9,337,049
- Issue date May 10, 2016
- Niko Semiconductor Co., Ltd.
- Chih Cheng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and packaging method of wafer level chip scale pa...
- Patent number 9,299,592
- Issue date Mar 29, 2016
- Niko Semiconductor Co., Ltd.
- Chih-Cheng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench power MOSFET and manufacturing method thereof
- Patent number 9,130,035
- Issue date Sep 8, 2015
- Super Group Semiconductor Co., Ltd.
- Hsiu-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench power MOSFET structure fabrication method
- Patent number 9,035,378
- Issue date May 19, 2015
- Super Group Semiconductor Co., Ltd.
- Hsiu-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power transistor having a top-side drain and forming method thereof
- Patent number 8,981,485
- Issue date Mar 17, 2015
- Super Group Semiconductor Co., Ltd.
- Hsiu-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench power MOSFET structure with high cell density and fabricatio...
- Patent number 8,900,950
- Issue date Dec 2, 2014
- Great Power Semiconductor Corp.
- Hsiu-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench power MOSFET structure and fabrication method thereof
- Patent number 8,872,266
- Issue date Oct 28, 2014
- Super Group Semiconductor Co., Ltd.
- Hsiu-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of trenched power semiconductor device with sour...
- Patent number 8,846,469
- Issue date Sep 30, 2014
- Great Power Semiconductor Corp.
- Chun Ying Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing the trench power semiconductor structure
- Patent number 8,785,277
- Issue date Jul 22, 2014
- Super Group Semiconductor Co., Ltd.
- Hsiu-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with low resistance of substrate and low po...
- Patent number 8,729,632
- Issue date May 20, 2014
- Niko Semiconductor Co., Ltd.
- Hsiu Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and fabrication method thereof
- Patent number 8,716,787
- Issue date May 6, 2014
- Super Group Semiconductor Co., Ltd.
- Sung-Nien Tang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240204095
- Publication date Jun 20, 2024
- NIKO SEMICONDUCTOR CO., LTD.
- SUNG-NIEN TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240194776
- Publication date Jun 13, 2024
- NIKO SEMICONDUCTOR CO., LTD.
- SUNG-NIEN TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH POWER SEMICONDUCTOR COMPONENT AND METHOD FOR MANUFACTURING T...
- Publication number 20230170412
- Publication date Jun 1, 2023
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- HSIU-WEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH POWER SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING TH...
- Publication number 20200343369
- Publication date Oct 29, 2020
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- HSIU-WEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH POWER SEMICONDUCTOR AND METHOD OF MAKING THE SAME
- Publication number 20200075739
- Publication date Mar 5, 2020
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- Hsiu-Wen HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200027968
- Publication date Jan 23, 2020
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- SUNG-NIEN TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH POWER SEMINCONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190386110
- Publication date Dec 19, 2019
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- HSIU-WEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20190378883
- Publication date Dec 12, 2019
- imat corporation
- Tsai-An Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL FILM WITH CONDUCTIVE FUNCTION
- Publication number 20190204486
- Publication date Jul 4, 2019
- imat corporation
- Tsai-An Yu
- G02 - OPTICS
Information Patent Application
TRENCH POWER SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING TH...
- Publication number 20190103489
- Publication date Apr 4, 2019
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- HSIU-WEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190019869
- Publication date Jan 17, 2019
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- Hsiu-Wen HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF A TRENCH POWER SEMICONDUCTOR DEVICE
- Publication number 20190006489
- Publication date Jan 3, 2019
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- HSIU-WEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH POWER SEMICONDUCTOR AND METHOD OF MAKING THE SAME
- Publication number 20190006479
- Publication date Jan 3, 2019
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- Hsiu-Wen HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH POWER SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING TH...
- Publication number 20180337236
- Publication date Nov 22, 2018
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- HSIU-WEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF A CHIP PACKAGE STRUCTURE
- Publication number 20180190507
- Publication date Jul 5, 2018
- NIKO SEMICONDUCTOR CO., LTD.
- CHIH-CHENG HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH POWER SEMINCONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180076297
- Publication date Mar 15, 2018
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- HSIU-WEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL CHIP PACKAGE STRUCTURE
- Publication number 20170338154
- Publication date Nov 23, 2017
- NIKO SEMICONDUCTOR CO., LTD.
- CHIH-CHENG HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPER-JUNCTION SEMICONDUCTOR DEVICE
- Publication number 20170309705
- Publication date Oct 26, 2017
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- SUNG-NIEN TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF TRENCH POWER MOSFET
- Publication number 20170047430
- Publication date Feb 16, 2017
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- HSIU-WEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH POWER TRANSISTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170033213
- Publication date Feb 2, 2017
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- HSIU-WEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPER JUNCTION DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160336440
- Publication date Nov 17, 2016
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- Hsiu-Wen HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20160336232
- Publication date Nov 17, 2016
- NIKO SEMICONDUCTOR CO., LTD.
- CHIH-CHENG HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ULTRA-THIN SEMICONDUCTOR DEVICE PACKAGE ASS...
- Publication number 20160211240
- Publication date Jul 21, 2016
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- CHIH-CHENG HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH POWER MOSFET AND MANUFACTURING METHOD THEREOF
- Publication number 20160190264
- Publication date Jun 30, 2016
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- HSIU-WEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD...
- Publication number 20160126228
- Publication date May 5, 2016
- NIKO SEMICONDUCTOR CO., LTD.
- CHIH-CHENG HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF WAFER LEVEL CHIP SCALE PACKAGE STRUCTURE
- Publication number 20160111293
- Publication date Apr 21, 2016
- NIKO SEMICONDUCTOR CO., LTD.
- CHIH CHENG HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH POWER MOSFET AND MANUFACTURING METHOD THEREOF
- Publication number 20150270384
- Publication date Sep 24, 2015
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- HSIU-WEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKAGING METHOD OF WAFER LEVEL CHIP SCALE PA...
- Publication number 20150262843
- Publication date Sep 17, 2015
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- Chih-Cheng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH POWER MOSFET AND MANUFACUTRING METHOD THEREOF
- Publication number 20150200294
- Publication date Jul 16, 2015
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- HSIU-WEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER TRANSISTOR HAVING A TOP-SIDE DRAIN AND FORMING METHOD THEREOF
- Publication number 20140361362
- Publication date Dec 11, 2014
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- Hsiu-Wen HSU
- H01 - BASIC ELECTRIC ELEMENTS

Hsiu Wen HSU

Person

Patents Grantslast 30 patents

Trench power semiconductor component and method of manufacturing th...

Trench power seminconductor device and manufacturing method thereof

Semiconductor power device and manufacturing method thereof

Trench power semiconductor and method of making the same

Manufacturing method of a chip package structure

Manufacturing method of a trench power semiconductor device

Trench power semiconductor component and method of manufacturing th...

Trench power semiconductor and method of making the same

Trench power semiconductor component and method of manufacturing th...

Trench power semiconductor device and manufacturing method thereof

Fan-out wafer level chip package structure

Super-junction semiconductor device

Chip package structure and manufacturing method thereof

Manufacturing method of ultra-thin semiconductor device package ass...

Trench power transistor structure and manufacturing method thereof

Manufacturing method of trench power MOSFET

Fan-out wafer level chip package structure and manufacturing method...

Trench power MOSFET and manufacturing method thereof

Trench power MOSFET and manufacturing method thereof

Manufacturing method of wafer level chip scale package structure

Package structure and packaging method of wafer level chip scale pa...

Trench power MOSFET and manufacturing method thereof

Trench power MOSFET structure fabrication method

Power transistor having a top-side drain and forming method thereof

Trench power MOSFET structure with high cell density and fabricatio...

Trench power MOSFET structure and fabrication method thereof

Fabrication method of trenched power semiconductor device with sour...

Method of manufacturing the trench power semiconductor structure

Semiconductor structure with low resistance of substrate and low po...

Power semiconductor device and fabrication method thereof

Patents Applicationslast 30 patents

POWER DEVICE AND METHOD FOR MANUFACTURING THE SAME

POWER DEVICE AND METHOD FOR MANUFACTURING THE SAME

TRENCH POWER SEMICONDUCTOR COMPONENT AND METHOD FOR MANUFACTURING T...

TRENCH POWER SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING TH...

TRENCH POWER SEMICONDUCTOR AND METHOD OF MAKING THE SAME

SEMICONDUCTOR POWER DEVICE AND MANUFACTURING METHOD THEREOF

TRENCH POWER SEMINCONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DISPLAY DEVICE

OPTICAL FILM WITH CONDUCTIVE FUNCTION

TRENCH POWER SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING TH...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

MANUFACTURING METHOD OF A TRENCH POWER SEMICONDUCTOR DEVICE

TRENCH POWER SEMICONDUCTOR AND METHOD OF MAKING THE SAME

TRENCH POWER SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING TH...

MANUFACTURING METHOD OF A CHIP PACKAGE STRUCTURE

TRENCH POWER SEMINCONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

FAN-OUT WAFER LEVEL CHIP PACKAGE STRUCTURE

SUPER-JUNCTION SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF TRENCH POWER MOSFET

TRENCH POWER TRANSISTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SUPER JUNCTION DEVICE AND METHOD OF MANUFACTURING THE SAME

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF ULTRA-THIN SEMICONDUCTOR DEVICE PACKAGE ASS...

TRENCH POWER MOSFET AND MANUFACTURING METHOD THEREOF

FAN-OUT WAFER LEVEL CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD...

MANUFACTURING METHOD OF WAFER LEVEL CHIP SCALE PACKAGE STRUCTURE

TRENCH POWER MOSFET AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND PACKAGING METHOD OF WAFER LEVEL CHIP SCALE PA...

TRENCH POWER MOSFET AND MANUFACUTRING METHOD THEREOF

POWER TRANSISTOR HAVING A TOP-SIDE DRAIN AND FORMING METHOD THEREOF