Hsiu-Yuan CHEN

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Zhubei City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method forming a semiconductor package device
- Patent number 12,094,727
- Issue date Sep 17, 2024
- Silicon Motion, Inc.
- Yi-Hung Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of fabricating an element
- Patent number 9,991,196
- Issue date Jun 5, 2018
- Silicon Motion, Inc.
- Shu-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FORMING A SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20230062499
- Publication date Mar 2, 2023
- SILICON MOTION, INC.
- Yi-Hung CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR WIRE BONDING AND TESTING AND FLASH MEMORIES FABRICATED...
- Publication number 20190013292
- Publication date Jan 10, 2019
- SILICON MOTION, INC.
- Shu-Ying HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING AN ELEMENT
- Publication number 20180082939
- Publication date Mar 22, 2018
- SILICON MOTION, INC.
- Shu-Ying HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING AN ELEMENT
- Publication number 20170271253
- Publication date Sep 21, 2017
- SILICON MOTION, INC.
- Shu-Ying HUANG
- H01 - BASIC ELECTRIC ELEMENTS