Hsu-Nan FANG

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,165,982
- Issue date Dec 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,142,576
- Issue date Nov 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 12,136,579
- Issue date Nov 5, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, optoelectronic package and method of manufactur...
- Patent number 11,791,434
- Issue date Oct 17, 2023
- Advanced Semiconductor Engineering, Inc.
- Jun-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 11,710,675
- Issue date Jul 25, 2023
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,605,597
- Issue date Mar 14, 2023
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including alignment material and method for m...
- Patent number 11,538,778
- Issue date Dec 27, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,502,024
- Issue date Nov 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,404,380
- Issue date Aug 2, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,316,274
- Issue date Apr 26, 2022
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer between a conductive substrate and plurality of semicond...
- Patent number 11,282,778
- Issue date Mar 22, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, assembly structure and method for manufacturing...
- Patent number 11,282,772
- Issue date Mar 22, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including two joint structures including differen...
- Patent number 11,276,661
- Issue date Mar 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with stacked die having traces on late...
- Patent number 11,257,788
- Issue date Feb 22, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,257,776
- Issue date Feb 22, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of the same
- Patent number 11,217,498
- Issue date Jan 4, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device structure
- Patent number 11,211,319
- Issue date Dec 28, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure of semiconductor device package and method of m...
- Patent number 11,195,771
- Issue date Dec 7, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 11,139,268
- Issue date Oct 5, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,139,252
- Issue date Oct 5, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 11,133,284
- Issue date Sep 28, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 10,943,843
- Issue date Mar 9, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsiu-Chi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,886,223
- Issue date Jan 5, 2021
- Advanced Semiconductor Engineering, Inc.
- Chun-Jun Zhuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device with thermal conducting material for h...
- Patent number 10,804,172
- Issue date Oct 13, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 10,797,019
- Issue date Oct 6, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,797,022
- Issue date Oct 6, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 10,593,630
- Issue date Mar 17, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing a semiconductor pack...
- Patent number 10,573,572
- Issue date Feb 25, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,475,775
- Issue date Nov 12, 2019
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230369154
- Publication date Nov 16, 2023
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230223352
- Publication date Jul 13, 2023
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, OPTOELECTRONIC PACKAGE AND METHOD OF MANUFACTUR...
- Publication number 20230144000
- Publication date May 11, 2023
- Advanced Semiconductor Engineering, Inc.
- Jun-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220415799
- Publication date Dec 29, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220367369
- Publication date Nov 17, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220262697
- Publication date Aug 18, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20220199559
- Publication date Jun 23, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20220059406
- Publication date Feb 24, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210366864
- Publication date Nov 25, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210327819
- Publication date Oct 21, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210225737
- Publication date Jul 22, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210193578
- Publication date Jun 24, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210175163
- Publication date Jun 10, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210175139
- Publication date Jun 10, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE STRUCTURE
- Publication number 20210159156
- Publication date May 27, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210159188
- Publication date May 27, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20210134692
- Publication date May 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, ASSEMBLY STRUCTURE AND METHOD FOR MANUFACTURING...
- Publication number 20210134711
- Publication date May 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210111139
- Publication date Apr 15, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210091042
- Publication date Mar 25, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210082853
- Publication date Mar 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210043604
- Publication date Feb 11, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20200402958
- Publication date Dec 24, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200388928
- Publication date Dec 10, 2020
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200381359
- Publication date Dec 3, 2020
- Advanced Semiconductor Engineering, Inc.
- Chun-Jun ZHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20200219845
- Publication date Jul 9, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsiu-Chi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200212005
- Publication date Jul 2, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200194383
- Publication date Jun 18, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200185286
- Publication date Jun 11, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACK...
- Publication number 20200027804
- Publication date Jan 23, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS

Hsu-Nan FANG

Person

Patents Grantslast 30 patents

Semiconductor package structure and method for manufacturing the same

Semiconductor package structure and method for manufacturing the same

Package structure and method for manufacturing the same

Electronic package, optoelectronic package and method of manufactur...

Package structure and method for manufacturing the same

Semiconductor package structure and method for manufacturing the same

Semiconductor package including alignment material and method for m...

Semiconductor device package and method of manufacturing the same

Semiconductor package structure and method for manufacturing the same

Semiconductor device package and method of manufacturing the same

Interposer between a conductive substrate and plurality of semicond...

Package structure, assembly structure and method for manufacturing...

Package structure including two joint structures including differen...

Semiconductor device package with stacked die having traces on late...

Semiconductor package structure and method for manufacturing the same

Semiconductor package and manufacturing method of the same

Device structure

Substrate structure of semiconductor device package and method of m...

Semiconductor package structure and method of manufacturing the same

Semiconductor package and method for manufacturing the same

Semiconductor package device

Semiconductor package structure

Semiconductor package

Semiconductor package device with thermal conducting material for h...

Semiconductor package and method for manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor package and method for manufacturing the same

Electronic device and method for manufacturing a semiconductor pack...

Semiconductor package device and method of manufacturing the same

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC PACKAGE, OPTOELECTRONIC PACKAGE AND METHOD OF MANUFACTUR...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

DEVICE STRUCTURE

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

PACKAGE STRUCTURE, ASSEMBLY STRUCTURE AND METHOD FOR MANUFACTURING...

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACK...