Hsu-Tien Hu

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming solder bumps on flip chips and devices formed
- Patent number 6,440,836
- Issue date Aug 27, 2002
- Industrial Technology Research Institute
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package incorporating elastomeric pads in dummy plugs
- Patent number 6,358,836
- Issue date Mar 19, 2002
- Industrial Technology Research Institute
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming solder bumps of improved height and devices formed
- Patent number 6,179,200
- Issue date Jan 30, 2001
- Industrial Technology Research Institute
- Ling-Chen Kung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR