Hsuan-Chan CHIANG

Person

New Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
3D extended cooling mechanism for integrated server
- Patent number 10,925,183
- Issue date Feb 16, 2021
- ADLINK TECHNOLOGY INC.
- Hsuan-Chan Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling mechanism of high mounting flexibility
- Patent number 10,736,235
- Issue date Aug 4, 2020
- ADLINK TECHNOLOGY INC.
- Hsiu-Ling Yu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling mechanism of high mounting flexibility
- Patent number 10,306,805
- Issue date May 28, 2019
- ADLINK TECHNOLOGY INC.
- Hsiu-Ling Yu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling mechanism of high mounting flexibility
- Patent number 10,212,859
- Issue date Feb 19, 2019
- ADLINK TECHNOLOGY INC.
- Hsiu-Ling Yu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Data storage device mounting structure
- Patent number 9,658,658
- Issue date May 23, 2017
- ADLINK TECHNOLOGY INC.
- Hsiu-Ling Yu
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
ELASTIC HEAT CONDUCTION MECHANISM FOR ELECTRONIC DEVICES
- Publication number 20240292570
- Publication date Aug 29, 2024
- ADLINK TECHNOLOGY INC.
- Hsiu-Ling YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D EXTENDED COOLING MECHANISM FOR INTEGRATED SERVER
- Publication number 20200275584
- Publication date Aug 27, 2020
- ADLINK TECHNOLOGY INC.
- Hsuan-Chan CHIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING MECHANISM OF HIGH MOUNTING FLEXIBILITY
- Publication number 20190014689
- Publication date Jan 10, 2019
- ADLINK TECHNOLOGY INC.
- Hsiu-Ling YU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING MECHANISM OF HIGH MOUNTING FLEXIBILITY
- Publication number 20170231117
- Publication date Aug 10, 2017
- ADLINK TECHNOLOGY INC.
- Hsiu-Ling YU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING MECHANISM OF HIGH MOUNTING FLEXIBILITY
- Publication number 20170223818
- Publication date Aug 3, 2017
- ADLINK TECHNOLOGY INC.
- Hsiu-Ling YU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DATA STORAGE DEVICE MOUNTING STRUCTURE
- Publication number 20170115706
- Publication date Apr 27, 2017
- ADLINK TECHNOLOGY INC.
- Hsiu-Ling YU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COOLING MECHANISM OF HIGH MOUNTING FLEXIBILITY
- Publication number 20160295743
- Publication date Oct 6, 2016
- ADLINK TECHNOLOGY INC.
- Hsiu-Ling YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-stack storage module board assembly
- Publication number 20080310095
- Publication date Dec 18, 2008
- ADLINK TECHNOLOGY INC.
- Hsuan-Chan Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hsuan-Chan CHIANG

Person

Patents Grantslast 30 patents

3D extended cooling mechanism for integrated server

Cooling mechanism of high mounting flexibility

Cooling mechanism of high mounting flexibility

Cooling mechanism of high mounting flexibility

Data storage device mounting structure

Patents Applicationslast 30 patents

ELASTIC HEAT CONDUCTION MECHANISM FOR ELECTRONIC DEVICES

3D EXTENDED COOLING MECHANISM FOR INTEGRATED SERVER

COOLING MECHANISM OF HIGH MOUNTING FLEXIBILITY

COOLING MECHANISM OF HIGH MOUNTING FLEXIBILITY

COOLING MECHANISM OF HIGH MOUNTING FLEXIBILITY

DATA STORAGE DEVICE MOUNTING STRUCTURE

COOLING MECHANISM OF HIGH MOUNTING FLEXIBILITY

Multi-stack storage module board assembly