Hsuan-Hao Mi

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Taichung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating electronic package
- Patent number 11,205,644
- Issue date Dec 21, 2021
- Siliconware Precision Industries Co., Ltd.
- Chi-Rui Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 10,629,572
- Issue date Apr 21, 2020
- Silicon Precision Industries Co., Ltd.
- Chi-Rui Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STACK STRUCTURE, METHOD FOR FABRICATING THE SAME, AND CARRI...
- Publication number 20200328142
- Publication date Oct 15, 2020
- Siliconware Precision Industries Co., Ltd.
- Don-Son Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20200212019
- Publication date Jul 2, 2020
- Siliconware Precision Industries Co., Ltd.
- Chi-Rui Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20190164941
- Publication date May 30, 2019
- Siliconware Precision Industries Co., Ltd.
- Chi-Rui Wu
- H01 - BASIC ELECTRIC ELEMENTS